Partition Assembly Layout to Contain Semiconductor Debris

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Solution Overview

Problem

Electronic devices, such as propulsion controllers or power supply devices, face the issue of semiconductor components scattering and damaging other components due to gaps between insulators and housings, leading to system failures.

Innovation Solution

The electronic device incorporates a partition assembly with a first partition separating electronic components and a second partition closing the gap between the first partition and the housing, preventing components from scattering and contacting each other.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If an insulator is attached to a cooling block between semiconductor devices, then the insulator prevents broken semiconductor pieces from scattering and damaging other semiconductor devices, but gaps between the insulator and housing allow scattering pieces to pass through and contact other semiconductor devices

Engineering Contradiction:

Improveprotection of semiconductor devicesVSAvoidscattering of broken pieces through gaps

Core Design Contradiction:

ReliabilityVSObject-affected harmful factors

Solution Approach 1:

The partition assembly is divided into multiple segments: a first partition that separates semiconductor devices, and a second partition that closes gaps between the first partition and housing. This segmentation allows each partition to address specific protection needs - the first partition prevents direct contact between devices while the second partition blocks scattered pieces from passing through gaps to other devices

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The partition assembly acts as an intermediary structure between the semiconductor devices and the housing. It provides a protective barrier that intercepts scattered broken pieces before they can reach other semiconductor devices, thereby preventing secondary damage while maintaining the functional layout of the electronic components

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If a partition assembly is introduced to close gaps and prevent scattering, then protection against component scattering is improved, but device complexity increases

Engineering Contradiction:

Improveprevention of component scatteringVSAvoidstructure of partition assembly

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The partition assembly serves multiple functions simultaneously: it separates adjacent semiconductor devices to prevent direct contact, closes gaps between the first partition and housing to block scattered pieces, and provides structural support within the housing. This multi-functionality reduces the need for additional separate protective components, thereby limiting the increase in device complexity

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12501569B2Electronic device

Publication Date: 2025.12.16 MITSUBISHI ELECTRIC CORP

AI summary

An electronic device includes a housing accommodating a plurality of electronic components, a base to which at least two of the plurality of electronic components are attached, and a partition assembly separating at least one electronic component of the at least two electronic components attached to the base from another electronic component of the at least two electronic components attached to the base. The partition assembly includes a first partition and a second partition. The first partition separates the at least one electronic component of the at least two electronic components from the other electronic component of the at least two electronic components. The second partition is located adjacent to the first partition and closes at least a part of a gap between the first partition and the housing.