Partition Plate Precoating for Plasma Processing Contamination
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Solution Overview
Problem
In separation type plasma processing apparatuses, the inner wall of the plasma generation chamber is exposed to plasma, leading to material scattering and contamination of the workpiece due to the wearing away of the partition plate, as the plasma generated in the plasma generation chamber leaks into the processing chamber, and the precoating process fails to form a protective film on the partition plate surface due to the narrow holes limiting plasma passage.
Innovation Solution
A plasma processing apparatus with a partition plate having holes with a maximum width of two times or less the sheath length, utilizing a first plasma source to generate plasma in the plasma generation chamber and a second plasma source to generate precoating plasma in the processing chamber, which is introduced through the partition plate holes to perform a precoating on the partition plate surface before main plasma processing, using a controller to manage the plasma sources and power supply.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the partition plate holes are made narrow to limit plasma leakage, then plasma control is improved, but precoating film formation on the partition plate surface fails
Solution Approach 1:
The patent applies preliminary action by performing precoating treatment before the main plasma processing. A precoating gas is supplied and plasma is generated to form a protective film on the partition plate surface in advance, so that when the main plasma processing occurs, the partition plate is already protected and material scattering is prevented.
Solution Approach 2:
The patent changes parameters by controlling the timing and conditions of plasma generation. The precoating plasma is generated under specific conditions (with precoating gas supply) before the main plasma processing, and the hole dimensions are precisely controlled (maximum width ≤ 2 times the sheath length) to achieve both plasma control and effective precoating.
2Productivity
If plasma is generated in the plasma generation chamber, then plasma processing is enabled, but material scattering occurs and workpiece contamination increases
Solution Approach 1:
The patent applies preliminary action by forming a protective precoating film on the partition plate surface before plasma processing begins. This protective layer prevents the partition plate material from scattering when plasma is generated, thereby enabling plasma processing while eliminating the harmful effect of material scattering.
Solution Approach 2:
The patent converts the potentially harmful plasma interaction with the partition plate into a beneficial effect. By supplying precoating gas and generating precoating plasma, the partition plate surface is modified to become more resistant to plasma erosion, turning the plasma exposure from a harmful process into a protective treatment.
3Reliability
If a partition plate with small holes is used to prevent plasma leakage, then plasma confinement is improved, but precoating gas introduction is limited
Solution Approach 1:
The patent changes parameters by precisely controlling the hole dimensions (maximum width ≤ 2 times the sheath length) and the precoating gas supply conditions. This parameter optimization allows sufficient precoating gas to pass through the small holes to form a protective film, while still maintaining effective plasma confinement during main processing.
Solution Approach 2:
The patent applies preliminary action by performing precoating treatment before main plasma processing. During this preliminary stage, precoating gas is supplied through the partition plate holes to form a protective film on the partition plate surface, ensuring that subsequent plasma processing can proceed with good confinement without material scattering.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration effectively suppresses contamination by forming a protective film on the partition plate, preventing material scattering and subsequent workpiece contamination during plasma processing.
Implementation Method 1
a first plasma source that generates plasma of the plasma excitation gas supplied into the plasma generation chamber by the first gas supply unit
Implementation Method 2
a second plasma source that generates plasma of the precoating gas supplied into the plasma generation chamber by the second gas supply unit and introduced into the processing chamber through the plurality of holes of the partition plate, or plasma of the precoating gas supplied into the processing chamber by the second gas supply unit
Implementation Method 3
a partition plate that has a plurality of holes each having a maximum width that is two times or less a sheath length corresponding to plasma of a plasma excitation gas
Data Source
AI summary
A plasma processing apparatus includes a partition plate, an antenna, and a high frequency power supply. The partition plate has a plurality of holes and partitions an inside of the processing container into a plasma generation chamber and a processing chamber. The antenna generates plasma of the plasma excitation gas supplied into the plasma generation chamber. The high frequency power supply generates plasma of a precoating gas supplied into the plasma generation chamber and introduced into the processing chamber through the plurality of holes of the partition plate. The plasma processing apparatus performs a precoating on a surface of a partition plate on a side of the processing chamber by causing the high frequency power supply to generate plasma of the precoating gas before a plasma processing using the plasma of the plasma excitation gas is performed.