Partition Wall Gas Supply for Substrate Processing
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Solution Overview
Problem
In substrate processing, the usage amount of atmosphere adjusting gas increases when the entire casing atmosphere is adjusted for low humidity or low oxygen concentration, leading to inefficiencies in gas usage during wafer processing.
Innovation Solution
A substrate processing apparatus with a partition wall that separates the processing space into two areas, using a first gas supply and a second gas supply connected to different positions on the partition wall to efficiently adjust the atmosphere around the wafer, reducing gas usage by supplying atmosphere adjusting gas only to the necessary area.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the entire casing atmosphere is adjusted for low humidity or low oxygen concentration, then the atmospheric conditions around the wafer are improved, but the usage amount of atmosphere adjusting gas increases
Solution Approach 1:
The patent divides the casing into multiple spaces using partition walls, separating the wafer processing area from other areas. Atmosphere adjusting gas is supplied only to the specific space where the wafer is located, rather than adjusting the entire casing atmosphere. This segmentation allows precise atmospheric control where needed while avoiding unnecessary gas consumption in other areas.
Solution Approach 2:
The patent implements local atmospheric adjustment by supplying atmosphere adjusting gas to specific locations (first space and second space) where wafers are processed, rather than uniformly adjusting the entire casing. Gas supplies are positioned at different locations to create localized atmospheric zones with appropriate humidity and oxygen concentration only where required for wafer processing.
2Stability of the object's composition
If atmosphere adjusting gas is supplied to the entire casing, then the atmospheric conditions are uniform throughout, but the gas consumption increases and efficiency decreases
Solution Approach 1:
The casing is segmented into multiple independent spaces (first space, second space, third space) using partition walls with specific openings. Each space can have its atmosphere independently controlled through dedicated gas supplies, allowing uniform atmospheric conditions within each localized area without requiring uniform adjustment throughout the entire casing, thereby improving gas usage efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration reduces the overall usage amount of atmosphere adjusting gas during wafer processing, effectively maintaining the predetermined atmospheric conditions while minimizing gas consumption.
Implementation Method 1
The first gas supply is connected to the partition wall, and supplies an atmosphere adjusting gas to the first space. The second gas supply is connected to a place different from the first gas supply in the partition wall, and supplies an atmosphere adjusting gas to the first space.
Data Source
AI summary
A substrate processing apparatus includes a substrate processing unit, a partition wall, a first gas supply, and a second gas supply. The substrate processing unit performs a liquid processing on a substrate. The partition wall separates a first space defined from a carry-in/out port through which the substrate is loaded to the substrate processing unit, and a second space other than the first space. The first gas supply is connected to the partition wall, and supplies an atmosphere adjusting gas to the first space. The second gas supply is connected to a place different from the first gas supply in the partition wall, and supplies an atmosphere adjusting gas to the first space.