Partition Wall LED Structure With Embossed Surfaces for Light Extraction
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Solution Overview
Problem
Current semiconductor light emitting devices face challenges in achieving excellent optical characteristics and reliability, particularly in intelligent lighting systems where individual control of light emitting device chips is required, leading to issues with contrast and durability under varying environmental conditions.
Innovation Solution
A pixel-type semiconductor light emitting device is designed with embossed portions on its surface, a partition wall structure, and a fluorescent layer within defined pixel spaces, along with a device separation insulating layer, to enhance light extraction efficiency and structural stability, thereby improving optical characteristics and reliability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Illumination intensity
If a conventional semiconductor light emitting device structure is used, then the device can be manufactured with standard processes, but the light extraction efficiency and optical characteristics are insufficient
Solution Approach 1:
The patent applies curvature by forming embossed portions with convex curved surfaces on the light emitting structures. These curved surfaces modify light propagation paths and improve light extraction efficiency by reducing total internal reflection at planar interfaces, directly addressing the insufficient light extraction efficiency while maintaining a relatively simple manufacturing process.
Solution Approach 2:
The patent divides the light emitting device into multiple light emitting structures arranged in an array, with each structure being a separate segment. This segmentation allows individual control of each light emitting structure, enabling intelligent lighting systems while improving overall light extraction efficiency through the combined effect of multiple embossed portions across different segments.
2Adaptability or versatility
If the device is designed for individual control in intelligent lighting systems, then versatility is improved, but reliability under varying environmental conditions deteriorates
Solution Approach 1:
The patent employs a partition wall structure that creates nested pixel spaces within the semiconductor device. Each pixel space contains a fluorescent layer surrounded by partition walls, forming a nested configuration that protects the fluorescent material from environmental stress while maintaining individual controllability of each pixel, thereby improving reliability under vibrations and shocks.
Solution Approach 2:
The partition wall structure serves as a protective cushioning element that is built beforehand to shield the fluorescent layer from mechanical stress, vibrations, and shocks. This prior cushioning approach ensures reliability under varying environmental conditions while preserving the individual control capability of each light emitting structure.
3Manufacturing precision
If embossed portions are added to improve light extraction, then optical characteristics are improved, but manufacturing complexity increases
Solution Approach 1:
The embossed portions are formed on the light emitting structures before the fluorescent layer is applied. This preliminary action allows the curved surface geometry to be established in advance, ensuring precise optical characteristics for light extraction while using standard semiconductor manufacturing processes that maintain ease of manufacture.
Solution Approach 2:
The embossed portions are localized to specific regions on the light emitting structures rather than requiring global structural modifications. This local quality approach improves optical characteristics at the embossed regions while keeping the rest of the manufacturing process simple and compatible with standard fabrication methods.
4Reliability
If a partition wall structure is introduced to define pixel spaces, then reliability is improved, but device complexity increases
Solution Approach 1:
The partition walls are formed as thin film structures that define pixel spaces without requiring bulky or complex three-dimensional structures. These thin film partition walls provide sufficient structural stability and protection for the fluorescent layer while minimizing the increase in device complexity, allowing the device to maintain a compact and manufacturable design.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves light extraction efficiency and contrast, while ensuring the semiconductor light emitting device's reliability even under conditions of repeated vibrations and shocks, such as in vehicle headlamps, by precisely controlling the embossed portions and partition wall structure.
Implementation Method 1
A plurality of embossed portions which protrude in a direction toward the fluorescent layer are formed on the plurality of light emitting structures
Implementation Method 2
a fluorescent layer provided in the plurality of pixel spaces
Data Source
AI summary
A semiconductor light emitting device is provided. The semiconductor light emitting device includes a plurality of light emitting structures, each of which includes a first surface and a second surface, a plurality of embossed portions provided on the first surface; a partition wall structure provided on the first surface of the plurality of light emitting structures and including a plurality of partition walls which define a plurality of pixel spaces; and a fluorescent layer provided in the plurality of pixel spaces. A bottom surface of the partition wall structure contacts the plurality of embossed portions.