Assembly Substrate Partition Walls for Low-Misassembly LED Transfer

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Solution Overview

Problem

Current methods for manufacturing display devices using semiconductor light-emitting diodes face challenges such as low transfer rates and high misassembly rates during the transfer of semiconductor light-emitting devices from an assembly substrate to a transfer substrate, particularly due to the complexity of large-scale display requirements and the limitations of existing transfer techniques like pick and place and laser lift-off.

Innovation Solution

An assembly substrate is designed with a base, parallel pair electrodes, a dielectric layer, and partition walls with recess and convex portions to reduce energy interaction between the assembly and transfer substrates, utilizing electric and magnetic fields to guide semiconductor light-emitting devices to predetermined positions, enhancing transfer efficiency and reducing misassembly.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Area of stationary object

If a large display requires millions of LEDs to be transferred, then the display size and resolution are improved, but the transfer difficulty and time increase significantly

Engineering Contradiction:

Improvedisplay areaVSAvoidtransfer rate

Core Design Contradiction:

Area of stationary objectVSProductivity

Solution Approach 1:

The invention divides the transfer process into two stages: first transferring LEDs to an assembly substrate in batches, then transferring from assembly substrate to final substrate. This segmentation reduces the complexity of transferring millions of LEDs directly to the final substrate, improving overall transfer efficiency and productivity.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The assembly substrate acts as an intermediary between the LED source and the final display substrate. By introducing this intermediate step, the system can manage and transfer large numbers of LEDs more efficiently, reducing the time and difficulty associated with direct transfer to the final substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Productivity

If self-assembly technique is used to transfer semiconductor light-emitting devices, then the transfer process is simplified and productivity is improved, but misassembly rate increases

Engineering Contradiction:

Improvetransfer efficiencyVSAvoidassembly accuracy

Core Design Contradiction:

ProductivityVSManufacturing precision

Solution Approach 1:

The invention introduces cells with specific structures (recess portions and/or concave-convex portions) at specific locations on the assembly substrate. These localized structural features provide precise positioning and recognition for the semiconductor light-emitting devices, ensuring correct orientation and placement while maintaining the efficiency of self-assembly.

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The invention replaces complex mechanical alignment and positioning systems with a simpler self-assembly mechanism guided by the cellular structures on the substrate. The recess and concave-convex portions provide mechanical cues that guide the devices into correct positions automatically, reducing misassembly while maintaining high productivity.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Productivity

If conventional transfer methods are used without specialized substrate structures, then the device structure is simple, but transfer rate is low and misassembly rate is high

Engineering Contradiction:

Improvetransfer rateVSAvoidsubstrate structure complexity

Core Design Contradiction:

ProductivityVSDevice complexity

Solution Approach 1:

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The proposed solution significantly improves the transfer rate and reduces misassembly by minimizing contact area and energy interaction between substrates, allowing for more efficient and precise placement of semiconductor light-emitting devices, thereby addressing the limitations of existing transfer methods.

Implementation Method 1

placing semiconductor light-emitting devices to predetermined positions of the assembly substrate using an electric field and a magnetic field

Methodology Applied

Scientific EffectElectric field: Electric Field

Implementation Method 2

placing semiconductor light-emitting devices to predetermined positions of the assembly substrate using an electric field and a magnetic field

Methodology Applied

Scientific EffectMagnetic field: Magnetic Field

Data Source

PatentEP3989283B1Substrate for manufacturing display device and method for manufacturing display device

Publication Date: 2024.03.27 LG ELECTRONICS INC

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AI summary

Provided is an assembly substrate, according to an embodiment of the present invention, used in a display manufacturing method to make semiconductor light emitting elements seated on a preset location of the assembly substrate by using an electric field and a magnetic field, the assembly substrate comprising: a base part; a plurality of pair electrodes extending in one direction and disposed to be in parallel on the base part; a dielectric layer stacked on the base part so as to cover the pair electrodes; and a partition wall stacked on the dielectric layer while forming a cell in which semiconductor light emitting elements are seated at predetermined intervals along an extending direction of the pair electrodes so as to overlap with a part of the pair electrodes, wherein at least one of a recessed portion and an uneven portion is formed on an upper surface of the partition wall.