Partitioned Bonding Regions for MEMS Sensor Airtightness
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Solution Overview
Problem
Existing electronic devices with MEMS-based sensor elements face issues with airtightness and performance due to unstable bonding states caused by uneven distribution of conductive wiring, leading to increased wiring resistance and parasitic capacitance, especially when combining acceleration and angular velocity sensors.
Innovation Solution
The electronic device design incorporates a dual accommodation space structure with partitioned bonding regions, allowing for balanced distribution of wirings between the first and second bonding regions, maintaining airtightness and reducing wiring resistance and parasitic capacitance by using anodic bonding and sealing techniques.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conductive wiring is disposed at the groove formed in the substrate and drawn to an electrode, then electrical connection is achieved, but a gap is generated in the bonding portion between substrate and lid member which deteriorates airtightness
Solution Approach 1:
The bonding portion is divided into a first bonding portion and a second bonding portion. The first bonding portion bonds the substrate and lid member while maintaining airtightness, and the second bonding portion provides electrical connection through conductive wiring. This segmentation allows each bonding portion to have specialized functions, resolving the conflict between airtightness and electrical connection.
Solution Approach 2:
A conductive adhesive is used as an intermediary material in the second bonding portion to achieve both electrical connection and bonding between the substrate and lid member. This intermediary material eliminates the need for separate wiring and bonding structures, maintaining airtightness while providing electrical connectivity.
2Reliability
If multiple wirings are provided in the bonding portion between substrate and lid member, then electrical connection is achieved, but the bonding state becomes unstable and airtightness is deteriorated
Solution Approach 1:
The bonding portion is segmented into first and second bonding portions. The first bonding portion contains no wiring and maintains stable bonding for airtightness, while the second bonding portion contains conductive wiring for electrical connection. This segmentation reduces the quantity of wiring in critical bonding areas while maintaining electrical functionality.
Solution Approach 2:
Different regions of the bonding portion have different properties: the first bonding portion has high bonding strength and airtightness properties, while the second bonding portion has electrical conductivity properties. This local differentiation allows each region to optimize its function without compromising the other.
3Reliability
If conductive wire is used for electrical connection between composite sensor device and IC, then electrical connection is achieved, but wiring resistance and parasitic capacitance increase leading to performance deterioration
Solution Approach 1:
The conductive wiring is merged with the bonding structure itself rather than being a separate component. The bonding adhesive serves dual purposes: bonding the substrate to the lid member and providing electrical connection pathways. This merging eliminates the need for separate conductive wires, reducing wire length and associated resistance and parasitic capacitance.
Solution Approach 2:
A conductive adhesive serves as an intermediary material that simultaneously provides mechanical bonding and electrical connection functions. This intermediary material creates direct electrical pathways between components without requiring separate wire connections, reducing overall connection length and improving performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the bonding strength and airtightness between the base materials, improving the accuracy and performance of the electronic device by balancing the bonding regions and reducing the length of connection members, thus maintaining high sensitivity and stability.
Implementation Method 1
maintaining a high degree of airtightness in a functional element accommodation space of the electronic device
Data Source
AI summary
An electronic device includes an accommodation space formed between a first base material and a second base material, and a first functional element and a second functional element in the accommodation space. The accommodation space is disposed in an internal region of a bonding portion that bonds the first base material and the second base material together. The bonding portion includes a first bonding region provided on one side thereof and a second bonding region provided on the other side thereof. The electronic device includes a first wiring portion which is electrically connected to the first functional element and has a first direction toward the outside of the accommodation space through the first bonding region, and a second wiring portion which is electrically connected to the second functional element and has a second direction toward the outside of the accommodation space through the second bonding region.