Partitioned Chassis Cooling With Dust-Filtered Airflow

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Solution Overview

Problem

Existing electronic devices face issues with dust accumulation through vents, leading to component breakdowns, requiring frequent and time-consuming disassembly and cleaning.

Innovation Solution

An electronic device design featuring a chassis with a partitioned space and L-shaped heat dissipation shell, utilizing fans and heat sinks to manage airflow and dustproof sponge on side walls, enhancing heat dissipation while preventing dust entry.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If vents are defined in the front panel for heat dissipation, then heat dissipation efficiency is improved, but dust accumulation in the chassis increases

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoiddust accumulation

Core Design Contradiction:

TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent introduces a dustproof sponge as an intermediary substance installed at the air inlet. This sponge allows air to pass through for heat dissipation while blocking dust particles from entering the chassis, thus resolving the contradiction between heat dissipation efficiency and dust accumulation

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent utilizes porous dustproof sponge material that permits air flow while filtering out dust particles. The porous structure enables selective permeability - allowing beneficial air flow for cooling while blocking harmful dust particles, thereby maintaining heat dissipation efficiency without dust accumulation

Inventive Principle:

Principle #31Porous materials

2Object-affected harmful factors

If the chassis is disassembled for cleaning dust, then dust accumulation is removed, but time is consumed and components may be damaged

Engineering Contradiction:

Improvedust removalVSAvoidcleaning time

Core Design Contradiction:

Object-affected harmful factorsVSLoss of time

Solution Approach 1:

The patent implements preliminary action by pre-installing a dustproof sponge at the air inlet to prevent dust from entering and accumulating in the first place. This preventive measure eliminates the need for subsequent disassembly and cleaning operations, saving time and avoiding potential component damage

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The dustproof sponge performs self-service by automatically filtering dust particles from the incoming air without requiring any manual intervention, disassembly, or cleaning operations. The system maintains itself by continuously blocking dust while allowing air flow, eliminating the need for user involvement in dust removal tasks

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively reduces dust accumulation and improves heat dissipation efficiency, minimizing the need for frequent cleaning and extending the lifespan of components.

Implementation Method 1

a semiconductor refrigeration piece (40), a first heat sink (50), a second heat sink (60)... the semiconductor refrigeration piece (40) having a cooling surface (44) facing the second space (27) and a heating surface (42) facing the first space (26)

Methodology Applied

Scientific EffectPeltier effect: Peltier Effect

Implementation Method 2

a first fan (80) and a second fan (90)... The first fan (80) is installed to the cooling pipe (72)... The second fan (90) is mounted to the top wall (25)

Methodology Applied

Scientific EffectForced convection: Forced Convection

Implementation Method 3

a first heat sink (50), a second heat sink (60)... the first heat sink (50) is received in the first space (26), and attached to the heating surface (42) of the semiconductor refrigeration piece (40)

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS9229498B2Electronic device with heat dissipation equipment

Publication Date: 2016.01.05 FULIAN PRESION ELECTRONICS (TIANJIN) CO LTD

AI summary

An electronic device includes a chassis, a partition plate mounted in the chassis, a semiconductor refrigeration piece, a first heat sink, a second heat sink, a heat dissipation shell, and a fan. A space of the chassis is partitioned to a first space and a second space by the partition plate. The first heat sink is received in the first space, and engaged with a heating surface of the semiconductor refrigeration piece. The second heat sink is received in the second space, and engaged with a cooling surface of the semiconductor refrigeration piece. The heat dissipation shell is received in the second space, and the second heat sink is received in the heat dissipation shell. The first fan is mounted on a first end of the heat dissipation shell, and a second end of the heat dissipation pipe defines an air outlet.