Partitioned EM-Shielding Packaging for Dense SiP Modules

Solution Overview

Problem

The existing methods for generating multi-partition EM-shielding structures in densely packed electronic components are complex, costly, and difficult to control, particularly in SIP packaging modules.

Innovation Solution

A packaging method involving the installation of metal components between electronic components on a substrate, followed by plastic-encapsulation using a hot mold that ensures the metal component's top remains uncovered, and subsequent formation of an EM-shielding layer, eliminating traditional laser grooving and silver glue processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Object-affected harmful factors

If traditional laser grooving and silver glue filling methods are used to generate EM-shielding partitions, then EM-shielding effect is achieved, but production process becomes complicated and cost increases

Engineering Contradiction:

ImproveEM interferenceVSAvoidproduction process complexity

Core Design Contradiction:

Object-affected harmful factorsVSDevice complexity

Solution Approach 1:

The circuit board is divided into multiple isolation regions by installing metal columns at specific positions between adjacent electronic components. These metal columns act as physical partitions that segment the board into independent EM-shielded zones, eliminating the need for complex laser grooving and silver glue filling processes while achieving effective EM interference isolation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent replaces expensive and complex laser grooving and silver glue filling operations with simple metal column installations. The metal columns are cost-effective components that can be easily positioned and fixed, significantly reducing production costs and process complexity while maintaining effective EM-shielding performance.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

2Object-affected harmful factors

If traditional laser grooving and silver glue filling methods are used, then EM-shielding partitions are formed, but production cost increases and quality control becomes difficult

Engineering Contradiction:

ImproveEM interferenceVSAvoidproduction cost and quality control

Core Design Contradiction:

Object-affected harmful factorsVSEase of manufacture

Solution Approach 1:

The circuit board is divided into multiple isolation regions by installing metal columns at specific positions between adjacent electronic components. These metal columns act as physical partitions that segment the board into independent EM-shielded zones, eliminating the need for complex laser grooving and silver glue filling processes while achieving effective EM interference isolation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent replaces expensive and complex laser grooving and silver glue filling operations with simple metal column installations. The metal columns are cost-effective components that can be easily positioned and fixed, significantly reducing production costs and process complexity while maintaining effective EM-shielding performance.

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Volume of moving object

If electronic components are densely distributed to achieve thin and small products, then product size is reduced, but EM interference problem increases

Engineering Contradiction:

Improveproduct sizeVSAvoidEM interference

Core Design Contradiction:

Volume of moving objectVSObject-affected harmful factors

Solution Approach 1:

The circuit board is divided into multiple isolation regions by installing metal columns at specific positions between adjacent electronic components. These metal columns act as physical partitions that segment the board into independent EM-shielded zones, eliminating the need for complex laser grooving and silver glue filling processes while achieving effective EM interference isolation.

Inventive Principle:

Principle #1Segmentation

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Simplifies production, reduces costs, and enhances EM-shielding performance by using metal components instead of silver glue, ensuring efficient and cost-effective partitioned EM-shielding.

Implementation Method 1

melted encapsulating material does not cover the top of the metal component

Methodology Applied

Scientific EffectMelting: Melting

Data Source

PatentUS20250385197A1Packaging method for generating partitioned em-shielding and an electronic packaging module

Publication Date: 2025.12.18 HUANWEI ELECTRONICS SHANGHAI CO LTD

AI summary

The present application provides a packaging method for generating partitioned EM-shielding and an electronic packaging module. The method comprising: installing at least two electronic components on a substrate surface; installing a metal component for EM-shielding on the substrate between at least one group of adjacent electronic components; utilizing a hot mold to plastic-encapsulate the electronic components and the metal component to form a plastic encapsulation; wherein, when the mold is closed, the top of the metal component is tightly abutted to the upper mold of the hot mold, so that melted encapsulating material does not cover the top of the metal component. After the plastic-encapsulation, an EM-shielding layer is formed outside the plastic encapsulation, which also covers the surface of the metal component exposed from the plastic encapsulation. The present application reduces cost of electronic packaging modules, improves production efficiency and EM-shielding effect of the module.