Partitioned Heat Pipe Vapor Chamber for High-Power Processor Cooling
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Solution Overview
Problem
Existing heat dissipation methods for high-power processors are inefficient in maintaining effective and consistent heat dissipation due to limited heat transfer capabilities.
Innovation Solution
A heat dissipation device comprising a vapor chamber, heat pipes with partitions dividing them into two channels, and a heat dissipation fin set, where the channels have radial cross-sectional areas that gradually decrease in opposite directions, enhancing the conversion of gaseous to liquid working medium without backflow.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If conventional heat dissipation elements (heat dissipation paste or heat sinks) are used, then the structure is simple, but the heat dissipation efficiency is limited
Solution Approach 1:
The patent utilizes phase change of working fluid between liquid and gas states to enhance heat transfer. The working fluid evaporates at the heating surface to absorb heat, then condenses in the condensation channel to release heat, creating a continuous phase transition cycle that significantly improves heat dissipation efficiency compared to conventional passive heat sinks
Solution Approach 2:
The heat pipe is divided into multiple functional sections: evaporation chamber, condensation chamber, and adiabatic section. Additionally, the condensation channel is further segmented into first and second condensation channels with different structures, allowing optimized heat transfer in each zone and improving overall heat dissipation performance
2Loss of energy
If heat dissipation elements use phase change of working fluid, then heat conduction is enhanced, but the device cannot maintain effective and consistent heat dissipation under large heat energy loads
Solution Approach 1:
The patent employs dynamic flow control mechanisms including a flow direction control plate and adjustable flow resistance structures. The flow resistance can be dynamically adjusted based on heat load conditions, allowing the system to maintain optimal working fluid circulation and consistent heat dissipation performance under varying high-power conditions
Solution Approach 2:
The system incorporates feedback mechanisms where the working fluid flow is continuously regulated based on temperature and pressure conditions within the heat pipe. This ensures that the phase change process remains stable and consistent, maintaining reliable heat dissipation even under large heat energy loads
3Loss of energy
If the heat pipe is divided into multiple channels, then the heat dissipation efficiency is improved, but the device complexity increases
Solution Approach 1:
The heat pipe is segmented into multiple channels including first and second condensation channels with distinct functions. This segmentation allows independent optimization of each channel's heat transfer characteristics while maintaining an integrated structure that manages complexity through functional specialization
Solution Approach 2:
The flow direction control plate and partition structures serve multiple functions: they guide working fluid flow, separate different channel functions, and can be integrated into the existing heat pipe manufacturing process. This multi-functionality reduces the need for additional separate components, thereby limiting the increase in device complexity
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The device achieves higher heat dissipation efficiency and maintains effective and consistent heat dissipation even with large amounts of heat energy generated by high-power processors.
Implementation Method 1
the liquid working medium absorbs heat of the heat source and then gasifies into a gaseous working medium
Implementation Method 2
the gaseous working medium moves into the first channel and the second channel to be condensed by the heat dissipation fin set, such that the gaseous working medium is liquefied into the liquid working medium
Implementation Method 3
the gaseous working medium moves into the first channel and the second channel to be condensed by the heat dissipation fin set
Implementation Method 4
the gaseous working medium moves into the first channel and the second channel to be condensed by the heat dissipation fin set
Data Source
AI summary
A heat dissipation device includes a vapor chamber for contacting a heat source; at least one heat pipe having a first end and a second end connected to the vapor chamber; at least one partition disposed inside the heat pipe to partition the inside of the heat pipe into a first channel and a second channel isolated from each other; and a heat dissipation fin set disposed on the vapor chamber and partially covers the heat pipe. The vapor chamber is filled with a liquid working medium that absorbs the heat of the heat source and then gasifies into a gaseous working medium. The gaseous working medium moves into the first channel and the second channel to be condensed by the heat dissipation fin set, so the gaseous working medium is liquefied into the liquid working medium, and then the liquid working medium flows back into the vapor chamber.