Partitioned Immersion Cooling Channels for Server Heat Control
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Solution Overview
Problem
Current immersion liquid-cooling systems for servers fail to achieve differential heat exchange and partitioned control for components with different power densities, leading to inefficient and uneconomical cooling due to indiscriminate cooling medium circulation.
Innovation Solution
A partitioned immersion liquid-cooling system with main and secondary flow channels, using fluid deflectors and adjustable shutters to direct cooling fluid to high- and low-power components separately, with a circulating pump and heat exchanger for efficient temperature control.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If the circulation rate of the cooling working medium is continuously increased to meet the heat dissipation requirements of high-power devices, then the heat dissipation effect is improved, but the pump work and energy consumption increase
Solution Approach 1:
The liquid-cooling chassis is divided into multiple independent flow channels (first flow channel, second flow channel, third flow channel) that correspond to different component regions. Each flow channel can independently control the circulation of cooling working medium, allowing high-power components to receive more cooling flow while low-power components receive less, thereby improving heat dissipation efficiency without proportionally increasing pump work.
Solution Approach 2:
Different flow channels are designed with different flow rates according to the local heat dissipation needs of components in each region. High-power components are directed to flow channels with higher circulation rates, while low-power components are directed to flow channels with lower circulation rates. This localized optimization ensures that cooling resources are allocated efficiently, improving overall heat dissipation while minimizing unnecessary pump work.
2Loss of energy
If the circulation rate of the cooling working medium is continuously increased to improve the heat exchange efficiency of various components, then the overall heat exchange efficiency is improved, but the economy decreases
Solution Approach 1:
The system segments the cooling domain into multiple flow channels with independent circulation control. This allows the cooling system to optimize heat exchange efficiency for each component region separately, ensuring that high-power components receive adequate cooling while avoiding excessive cooling of low-power components, thereby improving overall heat exchange efficiency without proportionally increasing energy consumption.
Solution Approach 2:
The flow channels are designed with adjustable flow rates that can dynamically adapt to the actual heat dissipation needs of components. This dynamic adjustment capability allows the system to optimize the balance between heat exchange efficiency and energy consumption, improving economy by reducing unnecessary pump work while maintaining effective heat exchange.
3Device complexity
If traditional air-cooled heat dissipation is used for chips in high heat flux density scenarios, then the system is simple, but it cannot meet the heat dissipation requirements
Solution Approach 1:
The liquid-cooling chassis is segmented into multiple flow channels that can be independently controlled. This segmentation allows the system to achieve effective liquid cooling for high heat flux density scenarios while maintaining a relatively simple overall structure. Each flow channel can be optimized for specific component regions, improving heat dissipation capability without proportionally increasing system complexity.
4Temperature
If fully liquid-cooled cold-plate heat dissipation is used, then the heat dissipation capability is improved, but the system becomes very complex
Solution Approach 1:
Instead of implementing fully liquid-cooled cold-plate heat dissipation across all components, the system segments the cooling approach by creating multiple flow channels with different circulation rates. High-power components receive liquid cooling through dedicated flow channels, while low-power components receive reduced cooling flow. This segmented approach maintains heat dissipation capability for critical components while significantly reducing system complexity compared to full liquid cooling.
Solution Approach 2:
The system applies liquid cooling with different intensities to different regions based on local heat dissipation needs. High-power component regions receive high-intensity liquid cooling, while low-power component regions receive low-intensity or reduced cooling. This localized approach achieves effective heat dissipation capability where needed while avoiding the complexity of implementing uniform full liquid cooling across the entire system.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The system achieves efficient and economical cooling by coordinating fluid flow based on component heat dissipation needs, minimizing pump power consumption and improving overall cooling efficiency.
Implementation Method 1
a liquid-state cooling working medium is filled in the liquid-cooling chassis, whereby the mainboard is immersed in the liquid-state cooling working medium
Implementation Method 2
with a circulating pump and heat exchanger for efficient temperature control
Implementation Method 3
with a circulating pump and heat exchanger for efficient temperature control
Data Source
AI summary
The present application relates to an immersion liquid-cooling system and a control method therefor, and a server. The immersion liquid-cooling system includes a liquid-cooling chassis filled with a liquid-state cooling working medium and a mainboard fixed in the liquid-cooling chassis in a vertical direction; the mainboard is provided with at least one high-power component and at least one low-power component; the liquid-cooling chassis includes a chassis body, main fluid deflectors, secondary fluid deflectors, and flow adjustment plates; the main fluid deflectors extend in the vertical direction to form a main flow channel, and the main flow channel contains all high-power components; the secondary fluid deflectors are arranged opposite to the main fluid deflectors to form secondary flow channels, and the secondary flow channels contain the low-power components; and the secondary flow channels are connected to the main flow channel by means of the flow adjustment plates.