Partitioned Leadframe Layout for Multi-Die Electrical Isolation
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Solution Overview
Problem
Existing packaging technologies for multi-die discrete electronic components fail to effectively isolate individual semiconductor dies, leading to undesirable electrical connections and increased component thickness, especially when using direct bonded copper or direct plated copper processes.
Innovation Solution
Implementing a partitioned leadframe with electrically isolated inner and outer portions to attach different dies, eliminating the need for costly DBC or DPC processes by ensuring electrical isolation through separate leadframe sections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If multiple semiconductor dies are embedded in a single discrete package, then space efficiency and power efficiency are improved, but electrical isolation between dies becomes difficult to achieve
Solution Approach 1:
The leadframe is segmented into multiple electrically isolated portions, with each portion dedicated to a specific semiconductor die. This segmentation prevents unwanted electrical connections between dies while maintaining their physical proximity within the same package, thus achieving both space efficiency and electrical isolation.
Solution Approach 2:
Electrically non-conductive material is introduced as an intermediary between adjacent leadframe portions to ensure electrical isolation. This mediator material fills the spaces between leadframe sections, preventing parasitic electrical connections while allowing the dies to remain closely spaced for compact packaging.
2Reliability
If DBC or DPC processes are used to achieve electrical isolation, then electrical isolation is improved, but manufacturing cost and complexity increase
Solution Approach 1:
The patent uses simple, inexpensive leadframe portions and standard molding materials instead of costly DBC (Direct Bonded Copper) or DPC (Direct Plated Copper) processes. The electrical isolation is achieved through the physical separation and non-conductive material rather than expensive metallurgical processes, significantly reducing manufacturing cost.
Solution Approach 2:
The patent changes the electrical conductivity parameter of the packaging structure by introducing electrically non-conductive material between leadframe portions. This parameter change achieves electrical isolation without requiring the complex DBC or DPC processes, simplifying manufacturing while maintaining isolation effectiveness.
3Ease of manufacture
If traditional packaging methods are used, then manufacturing simplicity is maintained, but component thickness increases
Solution Approach 1:
The patent transitions from vertical stacking (which increases thickness) to lateral arrangement of dies on separate leadframe portions. By utilizing the planar dimensions of the leadframe rather than stacking dies vertically, the package achieves compact thickness while maintaining manufacturing simplicity through standard leadframe and molding processes.
Data Source
AI summary
An illustrative apparatus may include a partitioned leadframe including an inner leadframe portion and an outer leadframe portion. The inner leadframe portion may be at least partially surrounded by the outer leadframe portion and may be electrically isolated from the outer leadframe portion. The apparatus may further include a first die attached to the partitioned leadframe, a second die attached to the partitioned leadframe, and a molding material encapsulating the first die, the second die, and at least a portion of the partitioned leadframe. The molding material may be recessed between the inner leadframe portion and the outer leadframe portion so as to leave a cavity on a side of the partitioned leadframe opposite the first die. Corresponding apparatuses, and methods for constructing them are also disclosed.