Partitioned Molded Component for Non-Overlapping Lead-Wire Soldering
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Solution Overview
Problem
The challenge in existing wheel speed sensor designs is the difficulty in soldering terminals due to their proximity, leading to potential contact and short circuits between adjacent solder parts.
Innovation Solution
A molded component design with a partitioned structure that separates and orients lead wires on different faces, allowing for separate soldering on non-overlapping sections, preventing contact and facilitating soldering work.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If terminals are arranged close to each other in the molded component, then the device compactness is improved, but the soldering work becomes difficult and adjacent solder parts may contact each other
Solution Approach 1:
The molded part is divided into multiple segments by forming partitions (separation walls) that divide the internal space. These partitions separate adjacent terminals and their corresponding solder parts, creating isolated working spaces for each soldering operation. This segmentation allows soldering to be performed on each terminal independently without risk of adjacent solder parts contacting each other, thereby resolving the contradiction between compactness and soldering ease.
2Area of stationary object
If terminals are arranged close to each other, then the space utilization is improved, but the risk of short circuit between adjacent solder parts increases
Solution Approach 1:
Partitions (separation walls) are introduced as intermediary structures between adjacent terminals. These partitions act as physical barriers that prevent solder parts from different terminals from coming into contact with each other. The partitions are integrated into the molded part structure, maintaining space utilization while providing reliable isolation to prevent short circuits between adjacent solder parts.
3Productivity
If soldering is performed on closely spaced terminals, then the manufacturing process speed is maintained, but the soldering precision and control become difficult
Solution Approach 1:
By segmenting the molded part into separate compartments using partitions, each terminal gains its own dedicated working space. This segmentation allows soldering operations to be performed with higher precision on each terminal independently, while the modular structure enables efficient production flow. The partitions prevent solder overflow to adjacent areas, ensuring manufacturing precision without sacrificing productivity.
Data Source
AI summary
A molded component 1 includes an internal component module including a first molded part, solder parts, and a second molded part. Lead wires include a first lead wire and a second lead wire. The first molded part includes a partition having a first face and a second face. The first lead wire has a first exposed section on the first face, and the second lead wire has a second exposed section on the second face. The first lead wire and the second lead wire are located at positions not overlapping with each other in a plan view from a direction in which the first face is oriented or a direction in which the second face is oriented. The solder parts include a first solder part located on the first face and a second solder part located on the second face.