Partitioned Multi-Layer Substrate for IC Thermal Management
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Solution Overview
Problem
Conventional integrated circuit (IC) packages with single piece heat slugs face challenges in achieving optimal thermal performance, circuit topology limitations, and external isolation, particularly in high-power applications, due to their structural configuration.
Innovation Solution
A multi-layered substrate with a ceramic intermediate layer and partitioned metal layers, allowing for direct bonded copper (DBC) technology, which includes copper layers on either side of the ceramic, enhancing thermal and electrical conductivity, and enabling complex circuit patterns and improved thermal isolation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If a single piece heat slug structure is used, then the structural simplicity is maintained, but the thermal resistance cannot be reduced below a desired value
Solution Approach 1:
The heat slug is divided into multiple separate heat slug sections (first heat slug section, second heat slug section, third heat slug section) that are positioned on different sides of the intermediate layer. This segmentation allows each section to be independently optimized and positioned to reduce thermal resistance pathways, while the intermediate layer provides thermal coupling between them.
2Ease of manufacture
If a single piece heat slug structure is used, then the manufacturing process is simplified, but circuit topologies and power output are limited
Solution Approach 1:
The first metal layer is partitioned into multiple sections (first section, second section, third section) with each section capable of carrying different circuit topologies. This allows independent optimization of each section for specific power conversion functions while maintaining a unified manufacturing process using standard PCB techniques.
Solution Approach 2:
Different sections of the first metal layer are designed with different circuit patterns and configurations optimized for their specific functions (e.g., half-bridge circuits, full-bridge circuits, control circuits). Each section can have tailored trace layouts, via distributions, and component placements according to its specific electrical requirements.
3Device complexity
If a single piece heat slug structure is used, then the assembly process is simplified, but external isolation is not provided
Solution Approach 1:
An intermediate layer is introduced between the first and second metal layers, serving as a thermal interface material or isolation layer. This intermediate layer provides thermal coupling while enabling electrical isolation and mechanical flexibility, allowing the package to be adapted to different heat sink configurations and external systems.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution significantly improves thermal performance by approximately 40% compared to conventional IC packages, enabling better heat dissipation and increased power output while facilitating miniaturization of power electronic modules.
Implementation Method 1
an intermediate layer disposed between the first metal layer, and the second metal layer
Implementation Method 2
The solution significantly improves thermal performance by approximately 40% compared to conventional IC packages, enabling better heat dissipation
Data Source
AI summary
An electronic device for use in power related applications includes a multi-layered substrate comprised of a first metal layer, a second metal layer, and an intermediate layer disposed between the first metal layer, and the second metal layer. The first metal layer is partitioned into sections, where each of the sections has a first surface and electrical circuits patterned onto the first surface. A lead frame is attached to outer portions of the first metal layer and a die is attached to the first surface of each of the sections of the first metal layer.