Partitioned Nozzle Module for Removing Mis-Assembled Micro LEDs
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Solution Overview
Problem
Current methods for assembling semiconductor light-emitting elements in display devices face challenges with mis-assembly, particularly in fluid-based self-assembly environments, where it is difficult to accurately position and remove mis-assembled elements of sizes several to several tens of micrometers on assembly substrates.
Innovation Solution
A module and method utilizing a fluid supply system with a housing and partitioned nozzle to selectively remove mis-assembled semiconductor light-emitting elements by injecting fluid onto specific sites, using an electric and magnetic field for positioning and a removal module with a fluid supply unit, upper and lower plates, and partition parts to isolate the mis-assembly site from adjacent elements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If fluid-based self-assembly is used to assemble semiconductor light-emitting elements, then assembly efficiency is improved, but mis-assembly occurs and removal becomes difficult
Solution Approach 1:
The nozzle is divided into multiple independent nozzle holes arranged in a matrix pattern, allowing selective fluid injection at specific locations. This segmentation enables precise targeting of mis-assembled elements without affecting adjacent properly assembled elements, thus resolving the contradiction between assembly efficiency and accuracy by allowing post-assembly correction.
Solution Approach 2:
A fluid medium is used as an intermediary to both assemble and remove semiconductor light-emitting elements. The same fluid system that facilitates self-assembly can be selectively applied to remove mis-assembled elements, providing a versatile solution that maintains high productivity while enabling correction of assembly errors.
2Ease of manufacture
If conventional removal methods are used for mis-assembled elements, then removal process is simple, but adjacent elements are dislodged causing further mis-assembly
Solution Approach 1:
The fluid injection system provides localized action through individually addressable nozzle holes. Fluid can be injected at specific locations corresponding to mis-assembled elements without affecting adjacent regions. This local quality approach maintains manufacturing simplicity while preserving the precision of adjacent element positions.
Solution Approach 2:
The nozzle structure is segmented into multiple independent injection points, allowing selective fluid delivery to specific mis-assembled elements. This segmentation enables precise removal operations that do not disturb adjacent properly assembled elements, resolving the contradiction between ease of removal and positioning accuracy.
3Reliability
If fluid is injected to remove mis-assembled elements, then removal effectiveness is improved, but adjacent elements may be dislodged
Solution Approach 1:
The system enables localized fluid injection at the precise location of mis-assembled elements through individually controlled nozzle holes. This local quality approach ensures effective removal of target elements while minimizing fluid impact on adjacent elements, thus maintaining both removal effectiveness and positioning accuracy.
Solution Approach 2:
The matrix arrangement of nozzle holes mirrors the matrix arrangement of semiconductor light-emitting elements on the substrate. This copying of the element layout allows each nozzle hole to correspond to a specific element position, enabling precise targeting and removal without affecting adjacent elements.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables precise removal of mis-assembled semiconductor light-emitting elements, preventing adjacent elements from being dislodged and ensuring high assembly accuracy and yield in large-area display manufacturing.
Implementation Method 1
a fluid supply unit to supply a fluid... The nozzle hole may allow communication between an inner space of the housing and an inner space of the chamber to inject the fluid supplied from the fluid supply unit to a site in which the semiconductor light-emitting element is mis-assembled
Implementation Method 2
semiconductor light-emitting elements introduced into a fluid accommodated in a chamber are self-assembled in cells of the assembly substrate arranged in a matrix form by using an electrical field and a magnetic field
Implementation Method 3
semiconductor light-emitting elements introduced into a fluid accommodated in a chamber are self-assembled in cells of the assembly substrate arranged in a matrix form by using an electrical field and a magnetic field
Data Source
AI summary
According to an embodiment of the present invention, a removal module using an electric field and a magnetic field so as to self-assemble, on cells arranged in a matrix form of an assembly substrate, semiconductor light-emitting elements introduced in a fluid accommodated in a chamber, and then remove a semiconductor light-emitting element mis-assembled with the assembly substrate comprises: a fluid supply unit for supplying the fluid; and a housing of which one side is connected to the fluid supply unit, an upper plate is adjacent to the assembly substrate, and a lower plate is adjacent to the chamber, wherein the upper plate has: a nozzle hole allowing communication between the inner space of the housing and the inner space of the chamber so that the fluid supplied from the fluid supply unit is injected at a site in which the semiconductor light-emitting element is mis-assembled on the assembly substrate; and one pair of partition parts facing each other with the nozzle hole as the center thereof.