Power Module Partition Chamber for Accurate Isolated Temperature Sensing

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Solution Overview

Problem

Power modules face challenges in achieving compact design and precise temperature measurement while ensuring electrical isolation of the temperature sensor from the high voltage level of semiconductors, especially during short circuits, which can lead to damage and inaccurate measurements.

Innovation Solution

The implementation of partition walls within the power module housing to create a chamber around the temperature sensor unit, maintaining thermal coupling with semiconductors while ensuring electrical isolation, and using a reduced wall thickness at the lower edge to enhance mechanical strength and insulation, allowing for compact design without increasing size or costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If the temperature sensor is positioned close to the semiconductors for accurate temperature measurement and compact design, then measurement precision and device compactness are improved, but electrical isolation reliability deteriorates due to the risk of voltage transfer during short circuits

Engineering Contradiction:

Improvetemperature measurement accuracyVSAvoidelectrical isolation reliability

Core Design Contradiction:

Measurement precisionVSReliability

Solution Approach 1:

The housing interior is segmented into a first region for the temperature sensor and a second region for the semiconductors using partition walls. This spatial segmentation allows the temperature sensor to be positioned close to the semiconductors for accurate temperature measurement while maintaining electrical isolation through the partition structure, even during short circuit conditions.

Inventive Principle:

Principle #1Segmentation

2Reliability

If the physical distance between semiconductors and temperature sensor is increased to ensure electrical isolation during short circuits, then electrical isolation reliability is improved, but measurement precision and device compactness deteriorate

Engineering Contradiction:

Improveelectrical isolation reliabilityVSAvoidtemperature measurement accuracy

Core Design Contradiction:

ReliabilityVSMeasurement precision

Solution Approach 1:

Partition walls serve as an intermediary structure between the temperature sensor and semiconductors. These partitions provide electrical isolation during short circuits while allowing the components to remain in close proximity for accurate temperature measurement. The partition walls act as a mediator that enables both reliability and measurement precision to coexist.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If the partition wall thickness is increased to enhance electrical isolation and mechanical strength, then reliability is improved, but device compactness and manufacturing cost deteriorate

Engineering Contradiction:

Improveelectrical isolation reliabilityVSAvoiddevice compactness

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The partition walls exhibit local quality variation with different thicknesses at different locations. The lower edge portion has a first thickness optimized for mechanical strength and short-circuit resistance, while the upper portion has a second, greater thickness for enhanced electrical isolation. This localized differentiation allows the device to achieve high reliability without excessive overall volume.

Inventive Principle:

Principle #3Local quality

4Ease of manufacture

If the partition wall thickness is uniform throughout, then manufacturing simplicity is improved, but mechanical strength at the lower edge and electrical isolation performance deteriorate

Engineering Contradiction:

Improvemanufacturing simplicityVSAvoidmechanical strength

Core Design Contradiction:

Ease of manufactureVSStrength

Solution Approach 1:

The partition walls are designed with non-uniform thickness, featuring a lower edge portion with a first thickness and an upper portion with a second, greater thickness. This local quality variation optimizes mechanical strength at the lower edge where it is most needed for short-circuit resistance, while providing enhanced electrical isolation in the upper portion, all within manufacturing capabilities.

Inventive Principle:

Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution allows for precise temperature measurement with high accuracy and compactness, while preventing voltage transfer from the main circuit to the control unit during short circuits, thus protecting the temperature sensor and maintaining device integrity.

Implementation Method 1

maintaining thermal coupling with semiconductors

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

ensuring electrical isolation, preventing voltage transfer from the main circuit to the control unit during short circuits

Methodology Applied

Scientific EffectElectrical insulation: Dielectric

Data Source

PatentEP4068349B1Power module

Publication Date: 2023.09.20 SIEMENS AG

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AI summary

The power module (9) according to the invention comprises a housing (100) which includes a carrier plate (1), housing walls (11), and a housing cover (8). The power module (9) also comprises semiconductor elements (2) and a temperature sensor unit (3, 4, 6) comprising a temperature sensor (3), which are arranged on the carrier plate (1) inside the housing (100). The power module (9) is characterized by partitions (10) which separate the temperature sensor unit (3, 4, 6) from the semiconductor elements (2) inside the housing (100) and enclose it in a chamber (15).