Partitioned Subring Expander for Laser-Singulated Die
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Solution Overview
Problem
Conventional die matrix expanders cannot accommodate a subring with a larger diameter due to the wafer frame's inner diameter, limiting the pick area and leading to edge chipping and die collisions during the die picking process, especially with laser-singulated die having small die spacing.
Innovation Solution
A partitioned subring with multiple pieces that expands beyond the wafer frame's inner diameter using a bidirectional path, allowing for increased pick area by moving outward and upward, facilitated by an electric motor drive system and mechanical force appliers to support and move the subring pieces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If a conventional one-piece subring is used in the die matrix expander, then the subring can be inserted through the wafer frame, but the pick area is limited by the wafer frame's inner diameter
Solution Approach 1:
The subring is divided into multiple separate segments that can be inserted through the wafer frame independently. These segments then expand radially outward to form a complete circular pick area that exceeds the wafer frame's inner diameter, effectively resolving the contradiction between insertability and pick area size.
2Reliability
If the subring is expanded to provide a larger pick area, then die picking safety improves, but the subring cannot pass through the wafer frame
Solution Approach 1:
By segmenting the subring into multiple smaller pieces, each segment can easily pass through the wafer frame's inner diameter. Once positioned, the segments expand to the required diameter to provide adequate pick area and ensure die picking safety, thus resolving the contradiction between ease of insertion and reliability.
Solution Approach 2:
The segmented subring segments are designed to nest within each other or within the wafer frame during insertion, similar to nested dolls. This allows the expanded subring structure to be compacted into a small insertable form factor, enabling easy passage through the wafer frame while maintaining the capability to expand to a larger functional size for safe die picking.
3Manufacturing precision
If laser saws are used for dicing to achieve small die spacing, then manufacturing precision improves, but the incidence of edge chipping increases during die picking
Solution Approach 1:
The segmented subring provides enhanced support to laser-singulated die with small spacings. The multiple segments can be positioned to individually support each die or groups of die, preventing edge chipping during the picking process while maintaining the precise small die spacing achieved by laser sawing.
Solution Approach 2:
The segmented subring structure allows for localized support at specific die positions. Each segment can be independently positioned to provide support exactly where needed for laser-singulated die with small spacings, addressing the edge chipping problem locally without affecting the overall precise die spacing arrangement.
Data Source
AI summary
A die matrix expander includes a subring including ≥3 pieces, and a wafer frame supporting a dicing tape having an indentation for receiving pieces of the subring. The subring prior to expansion sits below a level of the wafer frame and has an outer diameter <an inner diameter of the wafer frame. A translation guide coupled to the subring driven by mechanical force applier moves the subring pieces in an angled path upwards and outwards for stretching the dicing tape including to a top most stretched position above the wafer frame that is over or outside the wafer frame. A cap placed on the pieces of the subring after being fully expanded over the dicing tape locks the dicing tape in the top most stretched position and secures the pieces of the expanded subring in place including when within the indentation during an additional expansion during a subsequent die pick operation.