Partitioned Substrate Chamber for Simultaneous Heating and Cooling
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Solution Overview
Problem
The existing substrate processing systems face a throughput degradation due to the need to transfer substrates between separate heating and cooling chambers, which increases processing time and reduces efficiency.
Innovation Solution
A substrate processing apparatus with a single chamber containing both a substrate-heating region and a substrate-cooling region, separated by a partition to allow simultaneous heating and cooling processes, eliminating the need for inter-chamber transfers.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If separate heating and cooling chambers are used, then heating and cooling processes can be performed independently, but substrate transfer between chambers is required which degrades throughput
Solution Approach 1:
The patent combines separate heating and cooling chambers into a single integrated chamber that can simultaneously perform both heating and cooling processes on different substrates. The chamber is divided into a heating region with heating mechanisms and a cooling region with cooling mechanisms, allowing independent temperature control in each region while eliminating the need for substrate transfer between separate chambers, thus maintaining process independence while improving throughput
2Temperature
If substrate transfer between heating and cooling chambers is required, then temperature control is maintained, but processing time increases
Solution Approach 1:
The patent integrates heating and cooling functions within a single chamber, allowing multiple substrates to be processed simultaneously at different temperature zones. Substrates can be heated in the heating region while other substrates are cooled in the cooling region, eliminating transfer time while maintaining precise temperature control through independent heating and cooling mechanisms in each region
3Productivity
If a single chamber contains both heating and cooling regions, then throughput is improved, but heat and pressure interference between regions must be managed
Solution Approach 1:
The patent divides the single chamber into distinct heating and cooling regions separated by physical partitions or barriers. This segmentation allows independent control of temperature and pressure conditions in each region, preventing heat and pressure interference between the heating and cooling processes while enabling simultaneous operation to improve throughput
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances throughput by enabling continuous heating and cooling processes within a single chamber, improving processing efficiency and preventing gas sublimation from adhering to substrates.
Implementation Method 1
a heating mechanism configured to heat a first substrate in the at least one substrate-heating region
Implementation Method 2
a cooling mechanism configured to cool a second substrate in the at least one substrate-cooling region
Data Source
AI summary
A substrate processing apparatus includes: a chamber having a container including at least one substrate-heating region and at least one substrate-cooling region; a heating mechanism configured to heat a first substrate in the at least one substrate-heating region; a cooling mechanism configured to cool a second substrate in the at least one substrate-cooling region while the first substrate is being heated; and a partition provided in the container and configured to separate the at least one substrate-heating region and the at least one substrate-cooling region from each other in terms of heat and pressure.