Partitioned Substrates with Interconnect Bridges for Cost Reduction
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Solution Overview
Problem
The increasing demand for higher speed Serializer/Deserializer (SerDes) lanes in wired network switching applications leads to larger substrate sizes, resulting in exponential cost increases due to the need for more ball grid arrays (BGAs) and isolation BGAs, making current substrate sizes a significant driver of cost.
Innovation Solution
The use of partitioned substrates with high-density interconnect bridges that physically and electrically connect multiple substrates and chips, allowing for smaller substrate sizes while maintaining high signal integrity and reducing costs by accommodating the same number of BGAs as larger substrates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If substrate size is increased to accommodate more BGAs and isolation BGAs for higher speed SerDes lanes, then the number of supported signals and isolation is improved, but substrate cost increases exponentially
Solution Approach 1:
The invention divides a single large substrate into multiple smaller substrate modules (e.g., four 75mm substrates instead of one large substrate). Each module contains a subset of BGAs and can be independently manufactured and tested. The modules are then interconnected through interconnect bridges to form a complete functional unit, thereby reducing the cost of individual substrates while maintaining the total signal capacity.
Solution Approach 2:
The invention implements a hierarchical structure where multiple smaller substrate modules are nested within a larger system architecture. Each module is self-contained with its own chips and interconnects, and multiple modules are combined through interconnect bridges to create the full functionality of a larger substrate system, enabling cost-effective scaling.
2Quantity of substance
If substrate size is increased to accommodate more BGAs for high signal count applications, then signal capacity is improved, but substrate size becomes a main driver of increased cost above 75 mm
Solution Approach 1:
The invention segments the large substrate area into multiple smaller substrate modules, each staying below the 75mm cost threshold. By distributing the total signal count across multiple modules (e.g., 15 BGAs distributed across four modules), the system achieves high signal capacity without any single substrate exceeding the critical size threshold where costs escalate.
3Ease of manufacture
If multiple smaller substrates are used instead of a single large substrate, then substrate cost is reduced, but device complexity increases due to interconnect bridges
Solution Approach 1:
The invention introduces interconnect bridges as intermediary components that physically and electrically connect multiple substrate modules. These bridges serve as mediators that enable communication between modules while allowing each module to remain independently manufacturable and testable, thereby managing the complexity through modular interfaces rather than requiring a single complex large substrate.
Data Source
AI summary
The present disclosure relates to semiconductor structures and, more particularly, to partitioned substrates with interconnect bridge structures and methods of manufacture. The structure includes: a plurality of substrates; at least one chip bonded and electrically connected to each of the plurality of substrates; and an interconnect bridge that physically connects the plurality of substrates and electrically connects each of the plurality of chips bonded to each of the plurality of substrates.