Partitioned Wafer Trenches for Increased Die Density
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Solution Overview
Problem
As technology node sizes decrease, the reduced utilization of semiconductor wafers in manufacturing is hindered by the increasing number of scribe lines required for dicing, which reduces the number of dies that can be formed without damaging adjacent dies during the dicing process.
Innovation Solution
The method involves etching trenches between adjacent dies that are narrower than the dicing saw and do not contain test pads or alignment marks, while maintaining scribe lines for these purposes, allowing for increased die formation without compromising manufacturing quality.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If wide scribe lines are formed to guide the dicing saw, then the risk of damage to adjacent dies is reduced, but the number of dies that can be formed on a wafer decreases
Solution Approach 1:
The scribe line is segmented into a narrow portion (for guiding the dicing saw) and a wide portion (for containing test pads and alignment marks). This segmentation allows the scribe line to fulfill multiple functions with reduced overall width, thereby increasing the number of dies per wafer while maintaining reliability during dicing.
Solution Approach 2:
Different portions of the scribe line are given different widths to serve different functions. The narrow portion provides guidance for the dicing saw, while the wide portion accommodates test pads and alignment marks. This local differentiation optimizes space utilization and increases die density without compromising manufacturing quality.
2Productivity
If the number of scribe lines is reduced to increase die formation, then manufacturing capacity increases, but the quality of testing and alignment may be compromised
Solution Approach 1:
The scribe line is divided into functional segments: narrow portions for dicing guidance and wide portions for test pads and alignment marks. This segmentation ensures that even with fewer scribe lines, each scribe line can accommodate all necessary testing and alignment features, maintaining manufacturing precision while increasing productivity.
Solution Approach 2:
Each scribe line is designed to serve multiple functions simultaneously: guiding the dicing saw, containing test pads for electrical testing, and providing alignment marks for photolithography registration. This multi-functionality allows reduction in the total number of scribe lines while maintaining all necessary quality control functions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases the number of dies that can be formed on a wafer by reducing the number of scribe lines, enhancing manufacturing capacity and maintaining quality by ensuring adequate space for testing and alignment information.
Implementation Method 1
etching trenches between adjacent dies
Data Source
AI summary
A wafer includes a first set of dies and a second set of dies. The wafer further includes a scribe line separating the first set of dies from the second set of dies, wherein the scribe line has a first width. The wafer further includes a plurality of trenches between adjacent dies of the first set of dies and connected to the scribe line, wherein the plurality of trenches has a second width less than the first width, and a depth of each trench of the plurality of trenches is less than a thickness of the wafer.