Parylene Coated Silver Light Emitters for Sulfur Resistance
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Solution Overview
Problem
Conventional light emitter devices, such as LEDs, are susceptible to degradation from undesirable chemicals and chemical vapors, which can tarnish, corrode, or oxidize components, leading to reduced brightness and reliability, especially in high-power and high-brightness applications.
Innovation Solution
The implementation of a protective barrier or layer, typically a poly(p-xylylene) polymer coating applied via chemical vapor deposition, is used to prevent harmful chemicals and vapors from interacting with silver (Ag) components, thereby maintaining the optical and thermal properties of the devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional light emitter devices are used without protective coating, then the device structure remains simple and manufacturing is easier, but the components become tarnished, corroded, or degraded when exposed to chemicals and chemical vapors, reducing brightness and reliability
Solution Approach 1:
A thin film protective coating comprising a poly(p-xylylene) polymer is applied over the light emitter device components. This flexible thin film barrier prevents chemicals and chemical vapors from reaching and degrading the components while maintaining the overall simplicity of the device structure. The coating is sufficiently thin to not significantly increase device complexity but provides effective protection against corrosion and tarnishing.
Solution Approach 2:
The protective coating utilizes a composite material structure where a poly(p-xylylene) polymer layer is deposited over the metal components (such as silver traces or mounting surfaces). This composite structure combines the protective properties of the polymer with the conductive and structural properties of the underlying metal components, achieving both protection and functional performance.
2Reliability
If a protective barrier coating is applied to prevent chemical degradation, then chemical resistance and brightness retention improve, but the manufacturing process becomes more complex
Solution Approach 1:
The protective poly(p-xylylene) polymer coating is applied to the components before final assembly and encapsulation of the light emitter device. This preliminary application allows the coating to be deposited on exposed metal surfaces such as silver traces and mounting surfaces before they are covered by encapsulant material, ensuring complete protection of all vulnerable components without requiring post-assembly processing.
Solution Approach 2:
The protective coating is applied using chemical vapor deposition (CVD) or plasma-enhanced chemical vapor deposition (PECVD) processes, which replace traditional mechanical coating methods. This substitution enables uniform, thin-film deposition that automatically conforms to complex device geometries and provides consistent protective coverage without requiring manual application or complex mechanical coating equipment.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution significantly enhances the chemical resistance of light emitter devices, retaining approximately 95% or more of their initial brightness even in sulfur environments, compared to conventional devices which may retain only 60%, and prevents tarnishing and corrosion of Ag components.
Implementation Method 1
a protective barrier or layer, typically a poly(p-xylylene) polymer coating applied via chemical vapor deposition
Data Source
AI summary
Light emitter devices, components and methods are disclosed. In one aspect, a light emitter component of a light emitter device is disclosed. The light emitter component can include a silver (Ag) portion at least partially disposed over a surface of the component. The component can further include a protective layer at least partially disposed over the Ag portion, the protective layer at least partially including an organic barrier material that increases or improves chemical resistance of the Ag portion. In some aspects, the protective layer includes a polyxylylene (e.g., poly(p-xylylene), a substituted poly(p-xylylene), a fluorocarbon containing poly(p-xylylene), and/or any other polymer prepared from a xylylene and/or comprising —CH2—(C6H4)—CH2— based repeating units. In some aspects, the protective layer includes Parylene.