Parylene Passivation Layer for Micro-LED Electrode Transfer Protection
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Solution Overview
Problem
In the fabrication of micro light emitting diode (LED) display apparatus using micro-unit LED chips, the electrodes are exposed during transfer, leading to physical and chemical damage due to the external environment, which is not effectively addressed by existing methods.
Innovation Solution
A semiconductor device with a passivation layer, specifically using parylene, is introduced to cover the electrodes, preventing physical and chemical damage during the transfer process, and the passivation layer is designed to be non-reactive with electrolytes and easily removable for bonding.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If electrodes are exposed during transfer process, then transfer efficiency is improved, but electrode reliability deteriorates due to physical and chemical damage
Solution Approach 1:
A passivation layer is formed over the electrodes before the transfer process to protect them from physical and chemical damage. This preliminary protective action allows the electrodes to be transferred in a protected state, resolving the contradiction between transfer efficiency and electrode reliability.
Solution Approach 2:
The passivation layer acts as an intermediary between the electrodes and the external environment during transfer. It mediates the interaction by providing chemical resistance and physical protection, enabling safe transfer without direct exposure of electrodes to harmful environments.
2Reliability
If passivation layer is added to protect electrodes, then electrode reliability is improved, but device complexity increases
Solution Approach 1:
A thin film passivation layer is applied over the electrodes to provide protection without significantly increasing structural complexity. The thin film approach maintains device simplicity while delivering the required electrode protection during transfer operations.
3Object-affected harmful factors
If passivation layer covers electrodes, then chemical resistance is improved, but manufacturing complexity increases due to additional coating steps
Solution Approach 1:
The passivation layer is formed by controlling deposition parameters to achieve the desired thickness and chemical resistance properties. By optimizing deposition parameters, the layer provides adequate chemical protection while minimizing the impact on manufacturing simplicity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The passivation layer effectively protects the electrodes from damage during fluid self-assembly, enhancing the reliability of the electronic apparatus and facilitating the transfer process by preventing galvanic corrosion and physical scratches.
Implementation Method 1
The passivation layer may include a material that does not chemically react with an electrolyte
Implementation Method 2
The separating of the plurality of semiconductor device layers from the semiconductor substrate may be performed by immersing the semiconductor substrate in a potassium hydroxide (KOH) solution
Implementation Method 3
The passivation layer may be removed by using an oxygen (02) plasma treatment
Data Source
AI summary
Provided are a semiconductor device including a passivation layer and a method of fabricating an electronic apparatus including the semiconductor device. The semiconductor device includes a semiconductor device layer including at least one electrode provided at an upper portion thereof and a passivation layer at least partially covering the at least one electrode.