Rigidized Parylene Strap for Thermal Isolation and Electrical Communication
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Thermal isolation of micro-scale electrical and optoelectronic components is compromised by the need for power and signaling connections, which result in thermal coupling between components and their environment, particularly in chip-scale atomic devices.
Innovation Solution
A microscale rigidized Parylene strap is conformally coupled to both silicon substrates, suspending one substrate from the other while providing electrical communication through metallic traces, thereby achieving thermal isolation and mechanical support.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If electrical connections are provided between substrates to deliver power and signaling, then functional communication is enabled, but thermal coupling between substrates increases
Solution Approach 1:
The electrical connection path is segmented into multiple discrete conductive elements distributed across the substrate interface, rather than using continuous conductive pathways. This segmentation reduces the cumulative thermal conductance while maintaining electrical functionality, as each discrete element contributes minimally to heat transfer.
Solution Approach 2:
Thin film conductive layers are deposited on the substrate surfaces to provide electrical connection pathways. These thin films have low thermal mass and minimal thermal conductance compared to bulk conductive materials, enabling electrical communication while preserving thermal isolation between substrates.
2Strength
If rigid structural support is provided between substrates, then mechanical stability is improved, but thermal conduction increases
Solution Approach 1:
Composite structures combining materials with dissimilar thermal and mechanical properties are employed. For example, layers of low thermal conductivity materials are interspersed with thin conductive elements, creating a composite that provides mechanical rigidity through structural design while maintaining thermal isolation through the low-conductivity material layers.
Solution Approach 2:
Mechanical support is transitioned from direct substrate-to-substrate contact to indirect support through suspended structures or bridges that extend into the third dimension. This dimensional transition reduces the thermal contact area while maintaining mechanical load-bearing capacity through optimized geometric structures.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively minimizes thermal communication between substrates while enabling power and signaling to micro-scale components, enhancing thermal insulation and mechanical stability in microscale systems.
Implementation Method 1
The solution effectively minimizes thermal communication between substrates while enabling power and signaling to micro-scale components, enhancing thermal insulation and mechanical stability in microscale systems
Implementation Method 2
suspending one substrate from the other while providing electrical communication through metallic traces
Data Source
AI summary
An apparatus includes a chip-scale atomic clock (CSAC) alkali vapor cell seated on a silicon substrate that is suspended in a package by a metalized Parylene strap having Parylene anchors embedded in a silicon frame, the Parylene strap comprising an extended rigidizing structure, and a plurality of electrical pins extending into an interior of the package, the plurality of electrical pins in electrical communication with the CSAC cell through the metalized Parylene strap, where the CSAC cell is mechanically connected to the package and thermally insulated from the package.