PAS Resin Shielding Member with Chemical Etching Adhesion
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Solution Overview
Problem
The challenge is to create an electromagnetic wave-shielding member with a plating layer on a polyarylene sulfide resin molded product that offers high adhesive strength and excellent electric and magnetic field shielding properties, while being simple to manufacture and maintaining surface smoothness.
Innovation Solution
A method involving chemical etching to roughen the surface of a molded product made from a PAS resin composition, followed by a plating treatment, using a mixture of PAS resin, thermoplastic resin, carbonate, and polyolefin wax to enhance adhesive strength and shielding properties.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal film is formed on the surface of PAS resin molded product, then electromagnetic wave shielding performance is improved, but adhesion of the metal film deteriorates due to low adhesion of PAS resin
Solution Approach 1:
The surface of the PAS resin molded product is subjected to etching treatment before metal film formation to create a rough surface structure. This preliminary surface modification increases the surface area and creates mechanical interlocking sites that enhance adhesion of the subsequent metal coating layer.
Solution Approach 2:
The surface roughness parameter is changed through etching treatment to improve adhesion. By controlling the etching depth and surface roughness within specific ranges, the patent achieves optimal balance between adhesion enhancement and surface smoothness requirements.
2Reliability
If the surface of PAS resin molded product is etched with etchant, then adhesion of metal film is improved, but surface strength deteriorates making the surface fragile
Solution Approach 1:
The etching treatment parameters (etchant concentration, temperature, time) are precisely controlled to achieve optimal surface roughness without excessive erosion. This parameter optimization ensures the surface becomes rough enough for adhesion while maintaining sufficient surface strength and integrity.
Solution Approach 2:
The etching treatment is applied partially and controllably to create sufficient surface roughness for adhesion while avoiding complete surface degradation. The treatment depth is optimized to balance adhesion enhancement with surface strength preservation.
3Reliability
If the surface of PAS resin molded product is roughened by sand blasting or shot blasting, then adhesion of coating film is improved, but surface smoothness deteriorates
Solution Approach 1:
The patent replaces mechanical surface roughening methods (sand blasting, shot blasting) with chemical etching treatment. This substitution achieves surface roughness and adhesion enhancement through chemical reaction rather than mechanical impact, preserving surface smoothness while improving coating adhesion.
Solution Approach 2:
The surface roughness parameter is precisely controlled through chemical etching to achieve optimal adhesion without the excessive roughness caused by mechanical blasting methods. The chemical etching process allows fine control over surface morphology.
4Reliability
If multiple layers (primer resin layer, metal layer, plating layer) are formed successively, then adhesive strength and shielding properties are improved, but manufacturing complexity increases
Solution Approach 1:
The patent combines multiple functions into a single integrated process. The etching treatment and metal film formation are performed in sequence as a unified surface treatment process, eliminating the need for separate primer coating and multiple plating steps. This merging reduces manufacturing complexity while maintaining performance.
Solution Approach 2:
The etching treatment serves multiple functions: surface roughening for adhesion, surface cleaning, and surface activation. The subsequent metal film formation provides both electromagnetic shielding and corrosion protection. This multi-functionality reduces the number of separate processes needed.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides a laminated body with improved adhesive strength and enhanced electric and magnetic field shielding properties, achieving high shielding effectiveness with reduced material usage and processing time.
Implementation Method 1
roughening a surface of a molded product obtained by molding a PAS resin composition by a chemical etching treatment
Implementation Method 2
subjecting the roughened surface of the molded product to a plating treatment
Data Source
AI summary
Provided is a method for manufacturing an electromagnetic wave-shielding member that is a laminated body having a plating layer formed on a surface of a polyarylene sulfide (PAS) molded product. Provided are an electromagnetic wave-shielding member and a method for manufacturing the electromagnetic wave-shielding member including a step of roughening a surface of a molded product obtained by molding a PAS resin composition by a chemical etching treatment, and a step of subjecting the roughened surface of the molded product to a plating treatment, wherein the laminated body has a plating layer on at least two surfaces that are paired, and the PAS resin composition is obtained by mixing a PAS resin (A), a thermoplastic resin (B) other than the polyarylene sulfide resin selected from the group consisting of a thermoplastic elastomer (b1) and a hydrolyzable thermoplastic resin (b2), a carbonate (C), and a polyolefin wax (D).


