Pass-Through Connector Layout for High-Speed Signal Integrity
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Solution Overview
Problem
As computing systems evolve with increased processing power and smaller form factors, the communication between sockets and devices becomes critical, requiring interconnect architectures capable of supporting high data rates, but existing interconnects face challenges in signal integrity and complexity.
Innovation Solution
The implementation of pass-through connector devices that facilitate direct connections between socket connectors, reducing interconnect trace lengths and signal integrity loss, particularly for high-speed signaling, while maintaining compatibility with various form factors and protocols.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If traditional multi-drop buses are used for interconnects, then device complexity is reduced, but signal integrity deteriorates at high data rates
Solution Approach 1:
The interconnect architecture is segmented from traditional multi-drop buses into dedicated point-to-point lanes. Each socket connector has its own dedicated trace paths to device connectors, eliminating shared signal paths and reducing signal interference while maintaining manageable complexity through standardized lane configurations.
Solution Approach 2:
Socket connectors serve as intermediary elements that directly couple processing sockets to device connectors through controlled impedance traces. This intermediary structure provides signal conditioning and isolation, maintaining signal integrity by preventing direct coupling of multiple devices on shared buses while managing complexity through standardized connector interfaces.
2Adaptability or versatility
If interconnect trace lengths are increased to support more devices, then device versatility is improved, but signal integrity deteriorates
Solution Approach 1:
The connector design utilizes three-dimensional routing and stacking techniques to provide multiple connection paths. By adding vertical dimensionality through stacked trace layers and 3D routing, the system achieves versatile device connectivity without proportionally increasing horizontal trace lengths, thereby maintaining signal integrity while supporting multiple devices.
3Volume of moving object
If more processing power is integrated in smaller packages, then computing density is improved, but communication complexity between sockets increases
Solution Approach 1:
Multiple socket connectors and device connectors are merged into integrated connector assemblies with combined signal, power, and ground paths. This merging consolidates the communication architecture, reducing the complexity of inter-socket communication while maintaining high computing density through compact integrated designs.
Solution Approach 2:
The connector design implements universal interfaces that support multiple protocols and communication modes through standardized lane configurations. This multi-functionality allows the same physical infrastructure to support various socket-to-device communication patterns, reducing architectural complexity while enabling flexible high-density computing configurations.
Data Source
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AI summary
A pass-through connector includes a first socket connector to connect to a first device, where the first socket connector includes a first set of pins to connect to first contacts on the first device, and a second socket connector to connect to a second device, where the second socket connector includes a second set of pins to directly connect to the first set of pins within the pass-through connector, and a third set of pins to connect to a bus external to the pass-through connector. The second set of pins are to connect second contacts on the second device to the first contacts on the first device, and the third set of pins are to connect third contacts on the second device to the bus.