Passivated Semiconductor Substrate for Contaminant-Safe Soldering
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Solution Overview
Problem
Existing substrate production methods for power semiconductor modules often leave contaminants on the structured electrically conductive layers, which can cause damage when components are soldered onto them.
Innovation Solution
A method involving the formation of a structured first electrically conductive layer on a dielectric insulation layer, followed by the creation of incisions to separate sections, and the application of a passivation layer that covers the entire upper surface of the structured layer, thereby protecting it from contaminants.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the first electrically conductive layer is structured by creating incisions, then different sections are completely separated, but contaminants remain on the layer causing damage during soldering
Solution Approach 1:
A passivation layer is applied to the structured first electrically conductive layer before the soldering process. This preliminary protective action prevents contaminants from reacting with formic acid during subsequent soldering, thereby eliminating the harmful effects while maintaining the structural separation benefits.
2Ease of manufacture
If cleaning steps are performed after structuring, then some contaminants are removed, but complete removal cannot be reliably achieved
Solution Approach 1:
Instead of relying on post-structuring cleaning to achieve complete contaminant removal, the invention applies a passivation layer immediately after structuring. This preliminary protective measure ensures that any remaining contaminants cannot cause damage during soldering, thereby achieving reliable protection without requiring perfect cleaning.
3Reliability
If a passivation layer is applied to cover the entire upper surface, then contaminants are protected from reacting with formic acid, but the manufacturing process becomes more complex
Solution Approach 1:
The passivation layer is applied as a straightforward preliminary step between structuring and soldering. This simple protective coating prevents contaminant reactions with formic acid during soldering, achieving reliable damage resistance while adding minimal complexity to the manufacturing process.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The passivation layer effectively barriers contaminants from reacting with formic acid during soldering, reducing the risk of damage to the substrate and ensuring reliable operation of the semiconductor module.
Implementation Method 1
the passivation layer effectively barriers contaminants from reacting with formic acid during soldering
Data Source
AI summary
A method for producing a substrate for a semiconductor module includes: forming a first electrically conductive layer on a first side of a dielectric insulation layer; structuring the first electrically conductive layer by creating one or more incisions through the first electrically conductive layer that extend from an upper surface of the first electrically conductive layer down to the dielectric insulation layer, thereby completely separating different sections of the first electrically conductive layer; and forming a passivation layer covering the entire upper surface of the structured first electrically conductive layer.