Heterogeneous Passivation Structure for Low-Noise Embedded Traces

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Solution Overview

Problem

Conventional semiconductor packages face issues of excess cost, decreased reliability, and large package sizes, leading to inadequate performance.

Innovation Solution

The use of a heterogeneous passivation structure with high-resolution and high-function insulating materials, such as high-resolution polyimide, interleaved in semiconductor devices to form embedded traces, inhibiting signal noise and electromagnetic interference, and enhancing electrical performance.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional semiconductor packages are used, then manufacturing cost is reduced, but reliability decreases and electrical performance deteriorates due to signal noise and electromagnetic interference

Engineering Contradiction:

ImprovereliabilityVSAvoidmanufacturing cost

Core Design Contradiction:

ReliabilityVSEase of manufacture

Solution Approach 1:

The passivation structure is segmented into multiple layers with different functions: a first passivation layer for basic insulation and a second passivation layer with high-resolution material for precise trace formation and noise inhibition. This segmentation allows each layer to optimize for its specific function, improving overall reliability while maintaining manufacturing feasibility through standardized layering processes

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The patent employs composite passivation structures combining different dielectric materials with complementary properties. The first passivation layer provides mechanical protection and basic insulation, while the second passivation layer uses high-resolution material to suppress signal noise and electromagnetic interference. This composite approach enhances reliability without requiring complete redesign of the manufacturing process

Inventive Principle:

Principle #40Composite materials

2Reliability

If heterogeneous passivation structures with high-resolution materials are used, then electrical performance improves by reducing signal noise, but device complexity increases

Engineering Contradiction:

Improveelectrical performanceVSAvoiddevice complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The second passivation layer is selectively applied in regions where high-resolution trace formation and noise suppression are critical, such as over signal traces and interconnects. This localized application of high-performance material improves electrical performance in key areas without unnecessarily increasing complexity across the entire device structure

Inventive Principle:

Principle #3Local quality

Solution Approach 2:

The heterogeneous passivation structure is integrated within the existing semiconductor package architecture, with the second passivation layer nested within or adjacent to the first passivation layer. This nesting approach incorporates advanced functionality without requiring separate external structures, thereby limiting the increase in overall device complexity

Inventive Principle:

Principle #7Nested doll (Nesting)

3Reliability

If heterogeneous passivation structures with high-resolution and high-function insulating materials are used, then electrical performance improves by reducing signal noise and electromagnetic interference, but package size increases

Engineering Contradiction:

Improveelectrical performanceVSAvoidpackage size

Core Design Contradiction:

ReliabilityVSVolume of moving object

Solution Approach 1:

The patent addresses electrical performance issues by adding vertical layering of passivation materials rather than expanding horizontal trace spacing. The heterogeneous passivation structure stacks functional layers in the vertical dimension, enabling noise suppression and high-resolution routing without increasing the lateral footprint of the package

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

4Manufacturing precision

If heterogeneous passivation structures with high-resolution materials are used, then manufacturing precision improves for high-resolution traces, but ease of manufacture decreases

Engineering Contradiction:

Improvehigh-resolution tracesVSAvoidease of manufacture

Core Design Contradiction:

Manufacturing precisionVSEase of manufacture

Solution Approach 1:

The first passivation layer is formed and processed before applying the second passivation layer with high-resolution material. This preliminary action establishes a stable foundation and allows the high-resolution material to be applied under optimized conditions, achieving precise trace formation while managing manufacturing complexity through sequential processing

Inventive Principle:

Principle #10Preliminary action

Data Source

PatentUS20250309157A1Semiconductor devices and methods of manufacturing semiconductor devices

Publication Date: 2025.10.02 AMKOR TECH SINGAPORE HLDG PTE LTD

AI summary

In one example, an electronic device can comprise a substrate, a first passivation structure over the substrate and defining a first opening, and a first conductive pattern formed in the first opening. A second passivation structure can be disposed over the first conductive pattern and the first passivation structure. The second passivation structure can include a high-resolution material and a high-function material. The high-resolution material of the second passivation structure can define a second opening. A second conductive pattern can be disposed in the second opening of the second passivation structure. The high-function material can be disposed between the first conductive pattern and the second conductive pattern. Other examples and related methods are also disclosed herein.