Electronic Component Passivation Opening via Sacrificial Layer

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Solution Overview

Problem

Existing methods for producing electronic components face challenges in accurately opening electrically insulating passivation layers without precise alignment, which complicates the process and increases costs.

Innovation Solution

A method involving a sacrificial layer and a passivation layer, where the passivation layer is opened with an area smaller than the first region, allowing for the sacrificial layer's removal without high accuracy requirements, simplifying the process and reducing costs.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the passivation layer is opened with high precision alignment, then the opening accuracy is improved, but the process complexity and cost increase

Engineering Contradiction:

Improveopening accuracyVSAvoidprocess complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

A sacrificial layer is introduced as an intermediary element between the first region and the passivation layer. This sacrificial layer serves as a positioning reference that simplifies the alignment process for creating the opening in the passivation layer, thereby reducing process complexity while maintaining opening accuracy.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The sacrificial layer is arranged in advance above the first region before the passivation layer is applied. This preliminary positioning establishes a reference structure that guides subsequent opening creation, eliminating the need for high-precision alignment during the opening process and reducing overall process complexity.

Inventive Principle:

Principle #10Preliminary action

2Manufacturing precision

If the opening area is made smaller than the first region, then the positioning accuracy requirement is reduced, but the opening must still cover the first region effectively

Engineering Contradiction:

Improvepositioning accuracy requirementVSAvoidopening area coverage

Core Design Contradiction:

Manufacturing precisionVSArea of stationary object

Solution Approach 1:

The opening in the passivation layer is created with an area that is intentionally smaller than the first region (partial action). This approach reduces the positioning accuracy requirement because the smaller opening is easier to align precisely over the sacrificial layer, while the sacrificial layer extends beyond the opening to ensure complete coverage and functionality.

Inventive Principle:

Principle #16Partial or excessive action

Data Source

PatentUS10290997B2Method of producing an electronic component

Publication Date: 2019.05.14 OSRAM OLED

AI summary

A method of producing an electronic component includes providing a surface comprising a first region and a second region adjoining the first region, arranging a sacrificial layer above the first region of the surface, arranging a passivation layer above the sacrificial layer and the second region of the surface, creating an opening in the passivation layer above the first region of the surface, wherein the opening in the passivation layer is created with an opening area that is smaller than the first region, and removing the sacrificial layer and the portions of the passivation layer that are arranged above the first region.