Integrated Passive Cap Package for Compact RF Filters

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Solution Overview

Problem

Radio frequency (RF) filters and passive devices in wireless devices occupy significant space, limiting the number of frequencies small wireless devices can operate and communicate at, due to their large form factors.

Innovation Solution

A package configuration that includes an integrated device configured as a filter with a substrate comprising piezoelectric material and a metal layer, coupled with an integrated passive device acting as a cap, creating a void between them, which reduces the overall size while maintaining functionality.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Volume of moving object

If RF filters and passive devices are implemented with traditional configurations, then signal filtering functionality is achieved, but the device occupies significant space

Engineering Contradiction:
Improvedevice sizeVSAvoidsignal filtering functionality
Core Design Contradiction:
Volume of moving objectVSReliability

Solution Approach 1:

The patent combines the RF filter and passive devices into a single integrated device structure, where the filter is formed within the same device as the passive components. This merging eliminates the need for separate discrete components, significantly reducing the overall device volume while maintaining complete signal filtering functionality through the integrated resonator and electrode structure.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements a nested configuration where the RF filter structure is embedded within the passive device footprint. The resonator and electrodes are positioned within the same planar space as the passive components, creating a compact nested arrangement that reduces the total occupied area while preserving both filtering and passive device functions.

Inventive Principle:
Principle #7Nested doll (Nesting)

2Adaptability or versatility

If multiple RF filters and passive devices are included to enable operation at different frequencies, then frequency versatility is improved, but the device footprint increases

Engineering Contradiction:
Improvefrequency operation capabilityVSAvoiddevice footprint
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

The integrated device structure serves multiple functions simultaneously - it provides RF filtering capability while also incorporating passive device functionality within the same footprint. This multi-functional design allows the device to operate at different frequencies through the integrated resonator structure without requiring separate discrete filters, thereby maintaining frequency versatility while minimizing the overall device area.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

By merging the filter functionality with passive device components into a single integrated structure, the patent enables frequency versatility through the resonator's multiple modes of operation without requiring additional discrete components. This combination allows one device to perform what previously required multiple separate components, reducing the total footprint while maintaining adaptability across different frequencies.

Inventive Principle:
Principle #5Merging (Combining)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration provides a compact form factor and smaller footprint, allowing for more efficient use of space in small wireless devices while maintaining signal filtering and passive functionality.

Implementation Method 1

The integrated device includes a substrate comprising a piezoelectric material

Methodology Applied
Scientific EffectPiezoelectric effect: Piezoelectric Effect

Data Source

PatentUS12016247B2Package comprising an integrated passive device configured as a cap for a filter
Publication Date: 2024.06.18 QUALCOMM INC
  • US12016247B2 patent drawing
  • US12016247B2 patent drawing
  • US12016247B2 patent drawing

AI summary

A package that includes an integrated device, an integrated passive device and a void. The integrated device is configured as a filter. The integrated device includes a substrate comprising a piezoelectric material, and at least one metal layer coupled to a first surface of the first substrate. The integrated passive device is coupled to the integrated device. The integrated passive device is configured as a cap for the integrated device. The void is located between the integrated device and the integrated passive device.