Passive Component Hybrid Assembly for Stable Core Embedding
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Solution Overview
Problem
The integration of passive components like capacitors, inductors, and resistors into the package substrate core is challenging due to thickness mismatches, leading to shifting and rotation during embedding, which complicates electrical contact and manufacturing processes.
Innovation Solution
A reconstitution process is used to integrate passive components into a larger assembly by coupling them with a substrate, modifying the substrate's thickness to match the core, and securing them with adhesive and copper layers to prevent movement, followed by singulation into individual units.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If passive components are embedded directly into the core, then space utilization is improved, but the components shift or rotate during embedding due to thickness mismatch
Solution Approach 1:
The solution divides the embedding process into segments: first creating a recess in the core that matches the component thickness, then embedding the component into this pre-prepared space. This segmentation prevents the component from shifting or rotating during embedding while still achieving full space utilization in the core.
Solution Approach 2:
The recess is formed in the core before the passive component is embedded. This preliminary action creates a precisely fitted space that prevents movement during the embedding process, solving the positioning accuracy problem while maintaining space efficiency.
2Stability of the object's composition
If the core thickness is increased to match passive component thickness, then component stability is improved, but the total package thermomechanical stress level increases
Solution Approach 1:
Instead of increasing the entire core thickness, the solution creates a localized recess only where the passive component needs to be embedded. This local modification provides the necessary stability and thickness match for the component while keeping the rest of the core at its original optimized thickness, thereby avoiding increased thermomechanical stress.
Solution Approach 2:
The solution addresses the thickness mismatch by modifying the core in the vertical dimension (creating a recess) rather than increasing the overall core thickness in all dimensions. This dimensional approach provides local stability without globally increasing the core thickness and associated stress.
3Device complexity
If passive components are placed on the land side of the package, then routing complexity is reduced, but space utilization in the core is wasted
Solution Approach 1:
The solution segments the core into functional regions: routing areas for electrical connections and embedded component areas for passive components. This segmentation allows the core to serve dual purposes - maintaining routing simplicity while also utilizing the core space for component embedding, thus resolving the space waste problem.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method stabilizes the passive components within the core, ensuring proper electrical contact and simplifying manufacturing by reducing movement and rotation issues, thereby enhancing integration efficiency.
Implementation Method 1
securing them with adhesive and copper layers to prevent movement
Implementation Method 2
securing them with adhesive and copper layers to prevent movement
Data Source
Figure 1~2A
Figure 2B~2C
Figure 3A~3B
AI summary
Embodiments disclosed herein include assemblies with component substrates that are coupled to spacer base substrates. In an embodiment, such an apparatus comprises a first substrate with a first width, and a first layer on the first substrate. In an embodiment, a second substrate with a second width is over the first layer, and the second width is smaller than the first width. In an embodiment, a second layer is over the first substrate and around the second substrate.