Passive Component Module With Recessed Terminal Electrode
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Solution Overview
Problem
Existing electronic component modules face challenges in achieving low profile and high density mounting of passive components on substrates, with limitations in universality and expandability due to size constraints and solder spread issues, which restrict design freedom and integration efficiency.
Innovation Solution
A passive component configuration with a concavity in the mounting surface incorporating a terminal electrode, allowing for low-profile and high-density mounting by preventing solder spread and enhancing stability and fixing strength, while integrating with a built-in IC substrate for improved universality and expandability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a stud terminal is disposed on the module substrate to mount an inductor, then the inductor can be securely mounted, but the overall module height increases and low profile is unrealizable
Solution Approach 1:
The terminal electrode is moved from a protruding stud configuration (vertical dimension) to a recessed configuration within the mounting surface (horizontal dimension). This dimensional change allows the terminal electrode to be positioned at the same level as or below the mounting surface, eliminating the height increase caused by protruding studs while maintaining secure electrical connection through the recessed structure.
2Length of stationary object
If the terminal electrode is solder-mounted directly on the module substrate without using a stud terminal, then the module height is reduced, but solder spreads fillet-like on the periphery of the inductor requiring larger mounting area
Solution Approach 1:
The mounting surface is given a non-uniform local quality through the provision of a recessed region. This recessed area has different geometric properties (deeper, confined space) compared to the flat surrounding mounting surface. The recessed region specifically confines the solder to a localized area, preventing fillet-like spread to the periphery, while the overall mounting surface area remains compact for high-density mounting.
Solution Approach 2:
The terminal electrode is nested within a recessed region that is itself nested within the mounting surface. This nested structure creates a hierarchical arrangement where the solder is contained within the recessed region, which is contained within the overall mounting surface. This nesting prevents solder from occupying excessive peripheral area while maintaining secure electrical connection.
3Strength
If semiconductor chip and thin film magnetic inductor are fixedly attached by ultrasonic bonding only through the stud bump, then they can be securely bonded, but they must match closely in size reducing design freedom
Solution Approach 1:
The mounting structure with recessed terminal electrode serves multiple functions: it provides secure mechanical anchoring for the inductor, ensures reliable electrical connection, prevents solder spread, and accommodates various inductor sizes and configurations. This universal mounting approach allows different sized and shaped inductors to be mounted on the same substrate type, enhancing design freedom and versatility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables stable, low-profile, and high-density mounting of passive components on substrates, reducing noise and improving power efficiency by shortening wiring and enhancing heat dissipation, while allowing for greater design flexibility and integration efficiency.
Implementation Method 1
since the terminal electrode is incorporated in the concavity, solder is prevented from spreading fillet-like to the periphery of the passive component
Data Source
Figure 1A~1B
Figure 2
Figure 3
AI summary
An electronic component module is configured by a passive component mounted on a built-in IC substrate. The passive component is provided with a passive element inductor, and a mounting surface for mounting on a substrate. Concavities are respectively provided at parts of two opposed borders in the mounting surface, and a terminal electrode is provided at the bottom part of the concavities. Since the passive component has a concavity within the mounting surface and the terminal electrode is incorporated within this concavity, the passive component can be mounted low on the substrate surface. Since the terminal electrode is incorporated in the concavity, solder is prevented from spreading fillet-like at the periphery of the inductor, thus increasing the mounting density of the passive component. There is increased freedom for mounting the passive component because the passive component is mounted on the built-in IC substrate in which the IC is embedded in the substrate.