Passive Component Thermal Via for 5G Heat Dissipation
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Solution Overview
Problem
High-frequency RF circuit components face challenges with parasitic effects and overheating, which impact their performance and efficiency, especially in 5G systems where small footprint and low power consumption are critical.
Innovation Solution
Incorporating a thermally conductive via that provides a heat dissipation path between metallization layers and a substrate without affecting electrical connectivity, thereby reducing temperature and minimizing parasitic effects across operational ranges.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If passive electrical components are designed with small footprint for 5G systems, then area is reduced, but heat dissipation becomes more difficult leading to overheating
Solution Approach 1:
The patent introduces a vertical thermal conduction path through the substrate using thermally conductive vias, moving heat dissipation from a two-dimensional surface problem to a three-dimensional solution. The thermal via extends the heat dissipation path into the substrate thickness direction, allowing heat to be conducted away from the compact passive electrical component in the vertical dimension while maintaining small horizontal footprint.
Solution Approach 2:
The patent employs a substrate with high thermal conductivity as an intermediary heat dissipation medium. The substrate acts as a thermal conductor that receives heat from the passive electrical component through the thermally conductive via and distributes it across a larger area, effectively mediating between the compact component and the environment for improved heat dissipation.
2Object-affected harmful factors
If bond wire connections are eliminated to reduce parasitic effects, then electrical performance is improved, but thermal conduction paths are also removed reducing heat dissipation
Solution Approach 1:
The patent separates the electrical connection function from the thermal conduction function. The electrically conductive via provides electrical connectivity between metallization layers while the thermally conductive via provides dedicated thermal conduction path to the substrate. This segmentation allows electrical and thermal paths to be independently optimized without interfering with each other.
Solution Approach 2:
The patent introduces the substrate as an intermediary thermal conduction medium to replace the dual electrical-thermal function of bond wires. The substrate with high thermal conductivity acts as a dedicated thermal pathway that does not interfere with electrical signals, effectively mediating heat dissipation while maintaining electrical performance.
3Speed
If high frequency operation is implemented for 5G systems, then bandwidth and speed are improved, but parasitic effects become more predominant degrading performance
Solution Approach 1:
The patent extracts the thermal management function from the electrical connection structure. By removing bond wires and introducing separate thermally conductive vias, the design eliminates the parasitic inductance and resistance associated with bond wires while maintaining dedicated thermal conduction paths through the substrate.
Solution Approach 2:
The patent employs composite material structures including thermally conductive via materials with high thermal conductivity and low electrical conductivity, combined with the substrate material to create a composite thermal management system that effectively handles heat dissipation without interfering with high-frequency electrical performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively reduces temperature differences within RF components, enhancing their performance during high-frequency and high-current operations while maintaining minimal parasitic impact on electrical parameters.
Implementation Method 1
A thermally conductive via provides a thermally conductive path between the second metallization layer and the substrate
Implementation Method 2
The first dielectric layer has a lower thermal conductivity than the substrate
Data Source
AI summary
A passive electrical component includes a substrate. A first metallization layer is formed on the substrate. A first dielectric layer is formed on the first metallization layer The first dielectric layer has a lower thermal conductivity than the substrate. A second metallization layer is formed on the first dielectric layer. An electrically conductive via provides an electrical connection between a first section of the first metallization layer and a second section of the second metallization layer. A thermally conductive via provides a thermally conductive path between the second section and the substrate. The thermally conductive via provides an open circuit termination to the second section of the second metallization layer.