Passive Components in Vias for Stacked IC Power Delivery

The patent merges the passive components (inductors and capacitors) with the semiconductor die structure itself. Inductors are formed using spiral patterns of conductive material within the die, and capacitors are created using stacked conductive plates separated by dielectric layers, all integrated into the same substrate as the voltage regulator circuitry. This eliminates the need for separate external passive components while maintaining power delivery performance.

The patent employs nested structures where passive components are embedded within the die architecture. Conductive interconnect layers are stacked in multiple tiers, with capacitors formed between adjacent layers and inductors formed using spiral traces that utilize the vertical space between layers. This nested arrangement maximizes component density within the limited die area.

The patent extracts the passive components from external locations and relocates them directly onto the semiconductor die. By forming inductors and capacitors using the die's own conductive and dielectric layers, the invention eliminates the need for external mounting structures, vias, and connection bumps that would otherwise be required to attach separate passive components.

The patent makes the semiconductor die serve multiple functions: it acts as both the active circuit substrate and the mounting platform for passive components. The same conductive interconnect layers that route signals between transistors are also used to form inductor traces and capacitor plates, eliminating the need for dedicated passive component structures.