Passive Device EMI Shielding in Package Substrates
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Solution Overview
Problem
Existing electronic device packaging solutions for electromagnetic interference (EMI) shielding are costly and complex, requiring additional components and steps in the manufacturing process.
Innovation Solution
Incorporating passive devices, such as resistors, configured as EMI shields directly onto the substrate during the packaging process, which simplifies the fabrication and reduces costs by eliminating the need for metal frames or complex shielding structures.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If metal frames or complex shielding structures are used for EMI shielding, then EMI shielding effectiveness is improved, but manufacturing cost and device complexity increase
Solution Approach 1:
The patent replaces expensive metal frames with inexpensive passive devices (resistors, capacitors, inductors) that serve dual purposes as both functional electronic components and EMI shielding elements. These passive devices are standard, low-cost components already required in electronic circuits, eliminating the need for separate metal shielding structures.
Solution Approach 2:
The passive devices perform multiple functions simultaneously: they provide their intended electrical function (resistance, capacitance, or inductance) while also serving as EMI shielding elements. This multi-functionality reduces overall device complexity by eliminating dedicated shielding structures.
2Reliability
If metal frames or complex shielding structures are used for EMI shielding, then EMI shielding effectiveness is improved, but manufacturing cost increases
Solution Approach 1:
The patent uses inexpensive passive electronic components instead of costly metal frames. These passive devices are standard industry components with low manufacturing costs, and their dual function as both circuit elements and EMI shields significantly reduces overall manufacturing expenses.
Solution Approach 2:
The patent combines the EMI shielding function with existing passive devices in the circuit, merging two separate requirements (functional components and shielding structures) into a single integrated solution. This eliminates the need for separate shielding manufacturing processes and reduces overall manufacturing cost.
3Reliability
If separate EMI shielding components are added, then EMI shielding effectiveness is improved, but device complexity and manufacturing steps increase
Solution Approach 1:
The patent makes existing passive devices serve dual purposes as both functional electronic components and EMI shielding elements. This eliminates the need to add separate shielding components, maintaining device simplicity while achieving effective EMI protection.
Solution Approach 2:
The passive devices provide their own EMI shielding capability inherently, without requiring additional shielding structures. Each passive device serves itself by providing both its electrical function and EMI protection, reducing the total component count.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach provides effective EMI shielding while reducing manufacturing costs and complexity, offering flexibility in design and placement of shielding components.
Implementation Method 1
The plurality of passive devices forms an electromagnetic interference (EMI) shield
Data Source
AI summary
Packages are configured to include an electromagnetic interference (EMI) shield. According to one example, a package includes a substrate, an electrical component, and an EMI shield. The substrate includes a first surface and a second surface. The electrical component may be coupled to the first side of the substrate. The EMI shield is formed with at least one passive device. The at least one passive device is coupled to the first surface of the substrate. The at least one passive device is located laterally to the at least one electrical component, and extends along at least a portion of the electrical component. Other aspects, embodiments, and features are also included.