Semiconductor Package Assembly with Passive Device on Die
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional semiconductor packages face challenges in miniaturization and multi-functionality due to complex processing steps and high fabrication costs associated with embedded passive devices, as well as space constraints from passive devices placed on the solder-ball side of the substrate.
Innovation Solution
A semiconductor package assembly where a discrete passive device is positioned directly on the semiconductor die, fully overlapping it, with the passive device's pads coupled to the semiconductor die through conductive wires, and optionally using a carrier or insulating material to manage the passive device's placement and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If passive devices are embedded in the substrate, then multi-functionality is achieved, but processing complexity increases and fabrication cost increases
Solution Approach 1:
The patent extracts passive devices from the substrate embedding process and places them as separate components on the solder-ball side of the substrate. This eliminates the complex embedding processing steps while maintaining the multi-functional capability of the package assembly.
2Adaptability or versatility
If passive devices are embedded in the substrate, then multi-functionality is achieved, but fabrication cost increases
Solution Approach 1:
The patent extracts passive devices from the substrate embedding process and places them as separate components on the solder-ball side of the substrate. This eliminates the complex embedding processing steps while maintaining the multi-functional capability of the package assembly.
3Area of stationary object
If passive devices are disposed on the solder-ball side of the substrate, then space is utilized, but the passive devices must be thin and occupy space for positioning solder balls
Solution Approach 1:
The patent positions passive devices within the boundary area of the semiconductor die in plan view, allowing them to nest in the available space without increasing the overall package footprint. This enables thicker passive devices to be used while maintaining compact dimensions.
4Volume of moving object
If package size is reduced for miniaturization, then portability is improved, but space for positioning components is reduced
Solution Approach 1:
The patent utilizes the vertical dimension by placing passive devices on the solder-ball side of the substrate and positioning them within the semiconductor die boundary in plan view. This three-dimensional arrangement maximizes space utilization and enables package miniaturization while maintaining adequate component placement area.
Data Source
AI summary
A semiconductor package assembly includes a first substrate. A first semiconductor die is disposed on the first substrate. A passive device is located directly on the first semiconductor die. The passive device is disposed within a boundary of the first semiconductor die in a plan view.