Passive Device Embedded in Substrate with Segmented Electrodes
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Solution Overview
Problem
The miniaturization of electronic components poses challenges in the interlayer connection method, particularly with the laser via-forming process, where alignment deviations and electrical connection issues arise due to the reduced size of passive devices like MLCC, making it difficult to maintain accurate via-hole formation and electrode alignment.
Innovation Solution
A passive device embedded in a substrate with a modified external electrode structure, featuring larger upper and lower cover regions for the external electrodes, which are separated to prevent electrical interference, allowing for stable via mounting and alignment, even with smaller via sizes, thereby overcoming alignment deviations and ensuring reliable electrical connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the size of passive devices is reduced to meet miniaturization trends, then the area of external electrodes is reduced, but alignment precision and electrical connection reliability deteriorate
Solution Approach 1:
The external electrode is segmented into a body portion and an extended portion that protrudes beyond the laminate surface. This segmentation allows the electrode to have a smaller footprint on the device while maintaining a larger effective area for via alignment, thus resolving the contradiction between device miniaturization and alignment precision.
Solution Approach 2:
The electrode structure extends in the vertical dimension by protruding from the laminate surface. This dimensional extension provides a larger target area for via alignment without increasing the horizontal footprint, enabling both miniaturization and maintained alignment precision.
2Manufacturing precision
If via size is reduced to match smaller electrode pads, then manufacturing precision requirements increase, but electrical connection reliability may improve
Solution Approach 1:
The extended portion of the external electrode provides a localized area with different dimensional characteristics than the electrode body. This local quality change creates a larger effective pad area specifically for via connection, allowing smaller vias to be used while maintaining connection reliability through the extended electrode surface.
3Productivity
If laser processing is used for via formation, then productivity is improved, but alignment deviation occurs due to processing variability
Solution Approach 1:
The extended portion of the external electrode acts as a cushion zone that compensates for laser processing variability. By providing extra electrode surface area beyond the exact via target point, it cushions against alignment deviations and ensures reliable electrical connection even when via placement varies within acceptable tolerances.
Data Source
AI summary
The present invention relates to a passive device embedded in a substrate, which includes a laminate formed by alternately laminating a plurality of internal electrodes and dielectric layers; a first external electrode covering one side surface of the laminate and having a first upper cover region, which covers a part of an upper portion of the laminate, and a first lower cover region, which covers a part of a lower portion of the laminate and is smaller than the first upper cover region; and a second external electrode covering the other side surface of the laminate and having a second lower cover region, which covers a part of the lower portion of the laminate, and a second upper cover region, which covers a part of the upper portion of the laminate and is smaller than the second lower cover region, and the substrate.