Passive Heat Dissipating Structure for Telecommunication Chassis

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Solution Overview

Problem

Conventional cable gateways face overheating and electrical interference issues due to increased volume and broadband requirements, which can compromise performance and are often addressed inefficiently with the use of fans, leading to higher costs and power consumption.

Innovation Solution

A heat dissipating structure comprising a metal framework housed within a chassis, coupled with PCB modules and a perforated panel featuring ventilation holes, which allows for efficient heat dissipation through conduction and convection without the need for fans, also capable of absorbing electromagnetic interference and electrostatic discharge.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If fans are used to dissipate heat, then heat dissipation effectiveness is improved, but manufacturing cost and power consumption increase

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidpower consumption

Core Design Contradiction:

TemperatureVSUse of energy by stationary object

Solution Approach 1:

The patent removes the fan component from the heat dissipation system entirely, extracting the active cooling mechanism and replacing it with a passive heat dissipation structure comprising heat dissipation fins and natural convection channels, thereby eliminating the associated power consumption and manufacturing costs

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The heat dissipation structure utilizes natural convection and radiation to dissipate heat automatically without external power input, allowing the system to serve its own cooling needs through passively generated airflow patterns and thermal radiation from the fins

Inventive Principle:

Principle #25Self-service

2Temperature

If fans are used to dissipate heat, then heat dissipation effectiveness is improved, but manufacturing cost increases

Engineering Contradiction:

Improveheat dissipation effectivenessVSAvoidmanufacturing cost

Core Design Contradiction:

TemperatureVSEase of manufacture

Solution Approach 1:

Inventive Principle:

Principle #2Taking out (Extraction)

Solution Approach 2:

The patent employs simple, inexpensive passive heat dissipation components (fins and panels) that can be manufactured at low cost using standard fabrication processes, replacing the expensive and complex active cooling system with affordable static structures

Inventive Principle:

Principle #27Cheap short-living objects (Disposable)

3Adaptability or versatility

If multiple functions and broadband requirements are added to cable gateway, then functionality is improved, but heat generation and electrical interference increase

Engineering Contradiction:

ImprovefunctionalityVSAvoidheat generation and electrical interference

Core Design Contradiction:

Adaptability or versatilityVSObject-generated harmful factors

Solution Approach 1:

The metal framework serves multiple functions simultaneously: it provides structural support for the circuit boards, acts as a heat sink to conduct and dissipate thermal energy, and functions as an electromagnetic shield to block electrical interference, thereby addressing multiple harmful effects through a single multi-functional component

Inventive Principle:

Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent converts the harmful thermal energy generated by multiple functions into a manageable form by conducting it through the metal framework to dedicated heat dissipation fins, and transforms electromagnetic interference into blocked signals by using the same framework as an electromagnetic shield, thereby turning harmful byproducts into controlled phenomena

Inventive Principle:

Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution effectively reduces overheating and electrical interference, lowering manufacturing costs and power consumption by utilizing natural airflow and thermal conductivity to dissipate heat, thereby enhancing the performance and efficiency of telecommunication products.

Implementation Method 1

The metal framework is housed within the chassis and forms an internal chamber... utilizing natural airflow and thermal conductivity to dissipate heat

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

The internal chamber cooperates with the plurality of ventilation holes to dissipate heat... utilizing natural airflow and thermal conductivity to dissipate heat

Methodology Applied

Scientific EffectConvection: Convection

Implementation Method 3

The metal framework is housed within the chassis and forms an internal chamber... capable of absorbing electromagnetic interference and electrostatic discharge

Methodology Applied

Scientific EffectElectromagnetic shielding: Faraday Cage

Data Source

PatentUS10264703B2Heat dissipating structure

Publication Date: 2019.04.16 HITRON TECH INC

AI summary

A heat dissipating structure generally utilized in a telecommunication product includes a plurality of PCB modules, a metal framework, a top lid, and a perforated panel. The heat dissipating structure is generally utilized in a telecommunication product. The plurality of PCB modules are coupled in series and configured to form a chassis. The metal framework is housed within the chassis and forms an internal chamber. The top lid is disposed at a top side of the heat dissipating structure. The perforated panel is disposed below the top lid and over the internal chamber. The perforated panel includes a plurality of ventilation holes. The internal chamber cooperates with the plurality of ventilation holes to dissipate heat.