Passive Interface for Electronic Memory Signal and Power Multiplexing
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Solution Overview
Problem
Existing electronic memory systems require a large number of electrical connections to an exterior circuit, increasing the risk of errors, costs, and space requirements, as well as complicating the design of intrinsically safe systems for explosive environments.
Innovation Solution
A passive interface that connects an electronic memory device to an exterior circuit using a single electrical connection for both signal and power, utilizing passive components like resistors, capacitors, or inductors to reduce the number of connections needed, thereby minimizing space and electrical energy usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the number of electrical connections is increased to provide more power levels or data lines, then the functionality and versatility of the memory device is improved, but the risk of electrical shorts or errors increases and the cost and space requirements increase
Solution Approach 1:
The patent applies multi-functionality by enabling a single electrical connection to serve multiple purposes: it can transmit both power and data signals bidirectionally. The memory device and exterior circuit negotiate communication protocols and power levels through this single connection, eliminating the need for separate dedicated lines for each function while maintaining full operational versatility
Solution Approach 2:
The patent merges previously separate electrical connections (power lines, data lines, control lines) into a single unified connection. This consolidation combines multiple signal types and functions into one physical interface, reducing the total connection count while preserving all necessary communication and power delivery capabilities through intelligent signal multiplexing
2Productivity
If the number of electrical connections is increased to provide more data lines, then the data transmission capability is improved, but the total number of electrical connections and space requirements increase
Solution Approach 1:
The patent transitions from a spatial multiplication approach (adding more physical lines) to a temporal multiplexing approach (using one line at multiple times). Data transmission capability is enhanced by implementing bidirectional communication protocols that can serialize multiple data bits over time through the single connection, effectively increasing throughput without increasing physical footprint
3Area of stationary object
If the number of electrical connections is reduced, then the space requirements and cost are decreased, but the number of power levels or data lines available is reduced
Solution Approach 1:
The patent dynamically changes electrical parameters (voltage levels, current modes, signal timing) to encode multiple data bits and power levels through a single connection. By varying these parameters over time and using different signal states, the system achieves multiple effective data lines and power levels without requiring multiple physical connections, thus maintaining versatility while reducing space
4Adaptability or versatility
If more electrical connections are used, then more power levels or data lines are available, but the complexity of the interface increases
Solution Approach 1:
The patent implements self-service through automatic negotiation protocols where the memory device and exterior circuit autonomously determine the appropriate communication mode, power level, and data transmission parameters through their interaction over the single connection. This eliminates the need for complex external control logic and configuration, as the interface automatically adapts to the required functionality through built-in intelligence
Data Source
Figure 1~3A
Figure 3B~5
Figure 4A
AI summary
A passive interface for connecting an electronic memory device to an exterior circuit is provided. The passive interface includes a signal connection point, a power connection point and a ground connection point on an electronic memory device. A first passive component forms an electrical connection between the signal connection point and the power connection point. A second passive component forms an electrical connection between the power connection point and the ground connection point. And the power connection point receives a conditioned voltage signal through the electrical connection between the signal connection point and the power connection point. Such a passive interface can be used in a variety of devices, including headsets for intrinsically save applications.