Redistribution-Layer Passive Module for Compact Package Integration
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Solution Overview
Problem
Integrating passive components on-chip increases die area and costs, while surface mount technology (SMT) passive components in device packages lead to larger sizes and higher costs due to increased complexity and material usage.
Innovation Solution
A passive component module with a redistribution layer structure that includes conductive metal traces and dielectric layers, allowing for the integration of passive components like inductors, capacitors, and resistors within a compact module, which can be attached to a multilevel package substrate, reducing the need for external components and minimizing die area usage.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If passive components are integrated on-chip, then device compactness is improved, but die area increases and manufacturing cost increases
Solution Approach 1:
The invention segments the passive component integration into two distinct approaches: (1) true on-chip integration using conductive traces and dielectric layers formed during semiconductor fabrication for minimal area passive components, and (2) hybrid integration using SMT passive components mounted on the package substrate for higher value passive components. This segmentation allows each type of passive component to be integrated in the most area-efficient manner appropriate to its function and value.
Solution Approach 2:
The invention moves passive component integration from the traditional two-dimensional PCB level to the three-dimensional package level, utilizing vertical stacking and multiple layers within the package substrate. This dimensional transition enables passive components to be positioned in three-dimensional space around the semiconductor die, significantly reducing the footprint on the die itself while maintaining compact overall device dimensions.
2Adaptability or versatility
If SMT passive components are added in device package, then functionality is improved, but device size and manufacturing cost increase
Solution Approach 1:
The invention merges multiple fabrication processes into a unified hybrid integration approach. Conductive traces and dielectric layers are formed using standard semiconductor fabrication processes, while SMT passive components are mounted and connected using automated surface mount technology. The package substrate serves as a common platform that integrates both approaches, combining the precision of semiconductor fabrication with the flexibility of SMT assembly to achieve enhanced functionality without proportionally increasing complexity.
Solution Approach 2:
The package substrate serves multiple functions simultaneously: it acts as a mechanical support structure, an electrical interconnection platform for both on-chip and SMT passive components, a thermal management pathway, and a shielding barrier. This multi-functionality reduces the need for separate components and structures, thereby improving overall device functionality while limiting the increase in complexity.
3Adaptability or versatility
If more passive components are integrated, then device functionality is improved, but manufacturing cost increases
Solution Approach 1:
The invention performs preliminary actions by pre-forming conductive traces and dielectric layers on the package substrate using standard semiconductor fabrication processes before final assembly. This preliminary structuring creates a ready-made interconnection platform that simplifies subsequent SMT component mounting and reduces assembly complexity, thereby enabling higher passive component integration without proportionally increasing manufacturing cost.
Data Source
AI summary
A passive component module includes opposite first and second sides, a base extending to the second side, and a redistribution layer structure extending between the base and the first side, the redistribution layer structure including: a passive electronic component with a first component terminal and a second component terminal; a conductive metal trace that forms at least a portion of the passive electronic component; a dielectric layer abutting a portion of the conductive metal trace; a first terminal exposed along the first side and electrically coupled to the first component terminal; and a second terminal spaced apart from the first terminal and exposed along the first side, the second terminal electrically coupled to the second component terminal.