Passive-Over-Package Assembly for Power Module Heat Dissipation

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Solution Overview

Problem

Existing power modules face challenges in achieving high performance with a small areal footprint while maintaining robust electrical interconnections and efficient heat dissipation.

Innovation Solution

A semiconductor assembly is designed with a discrete passive element mounted over a semiconductor device package, thermally coupled by a region of gap filler material, and electrically connected through contact trenches and flowable electrical connection material, which compensates for geometric discrepancies.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a discrete passive element is mounted over a semiconductor device package to improve thermal coupling, then heat dissipation is enhanced, but the assembly complexity increases

Engineering Contradiction:

Improveheat dissipationVSAvoidassembly complexity

Core Design Contradiction:

TemperatureVSDevice complexity

Solution Approach 1:

The passive element serves dual functions: as an electrical component and as a heat sink. By combining these functions into a single component, the patent reduces overall assembly complexity while maintaining effective thermal coupling between the semiconductor device package and the passive element.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The passive element is designed to perform multiple roles simultaneously: providing electrical functionality (inductance/capacitance) and serving as a thermal management component. This multi-functionality eliminates the need for separate heat sink components, thereby reducing assembly complexity while improving heat dissipation.

Inventive Principle:

Principle #6Universality (Multi-functionality)

2Temperature

If gap filler material is used to thermally couple components, then thermal conductivity is improved, but manufacturing precision requirements increase

Engineering Contradiction:

Improvethermal conductivityVSAvoidgap filler application precision

Core Design Contradiction:

TemperatureVSManufacturing precision

Solution Approach 1:

The patent utilizes the flowable state of the electrical connection material to fill gaps during assembly, then transforms it to a solid state through curing. This parameter change allows the material to adapt to varying gap sizes and component tolerances, reducing manufacturing precision requirements while maintaining effective thermal and electrical coupling.

Inventive Principle:

Principle #35Parameter changes

Solution Approach 2:

The flowable electrical connection material acts as an intermediary substance that compensates for dimensional variations and misalignments between components. Its ability to flow and conform to the interface geometry eliminates the need for precise gap control, thereby reducing manufacturing precision requirements while ensuring adequate thermal contact.

Inventive Principle:

Principle #24Intermediary (Mediator)

3Reliability

If contact trenches are used for electrical connection, then electrical connectivity is improved, but device complexity increases

Engineering Contradiction:

Improveelectrical connectivityVSAvoiddevice structure complexity

Core Design Contradiction:

ReliabilityVSDevice complexity

Solution Approach 1:

The device carrier is segmented with contact trenches that create distinct electrical connection zones. This segmentation allows for organized and reliable electrical connections between the passive element leads and the semiconductor device package terminals, improving electrical connectivity while maintaining a systematic structure.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

The flowable electrical connection material automatically flows into the contact trenches and forms electrical connections without requiring additional assembly steps. This self-service characteristic improves electrical connectivity while avoiding the complexity of precise manual positioning or additional connection components.

Inventive Principle:

Principle #25Self-service

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides effective thermal coupling and electrical connectivity, ensuring consistent standoff height and heat dissipation, thereby enhancing the performance and efficiency of the power module.

Implementation Method 1

a region of gap filler material arranged between a lower surface of the main body and the upper surface of the semiconductor device package and thermally couples the semiconductor device package to the discrete passive element

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12532737B2Semiconductor device package thermally coupled to passive element

Publication Date: 2026.01.20 INFINEON TECHNOLOGIES AG

AI summary

A semiconductor assembly includes a device carrier that includes a dielectric core region and a plurality of contact pads disposed on an upper surface, a semiconductor device package having a plurality of lower surface terminals, a discrete passive element comprising a main body and a pair of leads, and a region of gap filler material, wherein the semiconductor device package is mounted on the device carrier with the lower surface terminals facing and electrically connected to a group of the contact pads, wherein the discrete passive element is mounted on the device carrier with the pair of leads electrically connecting with contact surfaces on the device carrier, and wherein the region of gap filler material is arranged between a lower surface of the main body and the upper surface of the semiconductor device package and thermally couples the semiconductor device package to the discrete passive element.