Passive Device Substrate Magnetic Shielding for Noise Reduction
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Solution Overview
Problem
Integrated passive devices with air core inductors face challenges in maintaining designed inductance values and Q values due to external device and wiring substrate interactions, and generate noise that affects other components, making it difficult to achieve desired circuit characteristics and reduce noise.
Innovation Solution
A passive device substrate is designed with a substrate, passive devices, an insulating layer, a magnetic layer on top, and a metal layer on the bottom, which absorbs and reflects noise, respectively, to stabilize the circuit characteristics and reduce noise interference.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an air core inductor structure is used in an integrated passive device, then the device can be integrated on a substrate, but the inductance value and Q value deviate from designed values due to external device and wiring substrate interactions
Solution Approach 1:
A magnetic shielding layer is introduced as an intermediary between the air core inductor and external devices/wiring substrates. This shielding layer mediates the interaction by providing magnetic flux confinement, preventing external magnetic fields from affecting the inductor, and thus maintaining the designed inductance value and Q value while preserving integration capability.
Solution Approach 2:
The magnetic properties of the shielding layer are specifically designed with particular permeability and thickness parameters to optimize magnetic flux confinement. By adjusting these parameters, the system achieves both integration versatility and precise inductance control, resolving the contradiction between adaptability and manufacturing precision.
2Adaptability or versatility
If an air core inductor structure is used in an integrated passive device, then the device can be integrated on a substrate, but the inductor generates noise that affects other devices and wiring substrates
Solution Approach 1:
The magnetic shielding layer acts as an intermediary that confines magnetic flux within the inductor structure, preventing noise generation and electromagnetic interference with surrounding devices. This allows the integrated passive device to maintain integration capability while eliminating the harmful noise emission effect.
3Ease of operation
If integrated passive devices are mounted on a wiring substrate, then circuit functionality is achieved, but the inductor is affected by other devices and interconnection patterns causing characteristic deviation
Solution Approach 1:
The magnetic shielding layer serves as a protective intermediary between the air core inductor and the wiring substrate environment. It maintains circuit functionality by allowing the inductor to operate while simultaneously protecting against external magnetic interference from other devices and interconnection patterns, thus ensuring characteristic stability and reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively maintains desired circuit characteristics and reduces noise emission by absorbing noise generated by passive devices and reflecting external noise, thereby improving the performance and reliability of passive device substrates.
Implementation Method 1
a magnetic layer disposed on an opposite side of the insulating layer from the substrate to overlap the passive device in a plan view taken in a thickness direction of the substrate
Implementation Method 2
a metal layer disposed on a second surface of the substrate to overlap the passive device in the plan view
Data Source
AI summary
A passive device substrate includes a substrate, a passive device disposed at a first surface of the substrate, an insulating layer disposed on the first surface of the substrate to cover the passive device, a magnetic layer disposed on an opposite side of the insulating layer from the substrate to overlap the passive device in a plan view taken in a thickness direction of the substrate, and a metal layer disposed on a second surface of the substrate to overlap the passive device in the plan view.