Passive Thermal Coupler for Folding Device Heat Dissipation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
High-performance laptops generate excessive heat due to compact internal components, leading to energy consumption and noise issues with traditional active cooling methods, which are impractical in small form factors.
Innovation Solution
A heat dissipating apparatus for folding electronic devices that utilizes a base portion with a heat-generating component, a thermally insulating component between the display screen and heat dissipating component, and a coupler to transfer heat through conduction and convection, enhancing heat dissipation without battery power consumption.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a cooling fan is used to dissipate heat from the CPU and GPU, then heat dissipation effectiveness is improved, but energy consumption from the battery increases
Solution Approach 1:
The patent replaces the mechanical active cooling system (cooling fan) with a passive thermal conduction system. The coupler acts as a thermal bridge that conducts heat from the heat-generating components to the heat-dissipating component without requiring mechanical motion or energy input, thereby eliminating battery consumption while maintaining heat dissipation effectiveness.
Solution Approach 2:
The thermal management system operates autonomously using natural heat conduction and dissipation mechanisms. The coupler automatically transfers heat from the CPU/GPU to the heat-dissipating component without requiring external power or control systems, allowing the device to self-regulate temperature through passive thermal pathways.
2Temperature
If a cooling fan is used to dissipate heat, then heat dissipation effectiveness is improved, but noise level increases
Solution Approach 1:
The patent eliminates the mechanical cooling fan that generates noise by substituting it with a passive thermal conduction system. The coupler and heat-dissipating component form a silent thermal pathway that transfers heat without mechanical movement, thereby completely eliminating fan noise while maintaining effective heat dissipation.
3Temperature
If a cooling fan is used to dissipate heat, then heat dissipation effectiveness is improved, but occupied space increases
Solution Approach 1:
The patent extracts and removes the cooling fan from the device architecture, replacing it with a distributed thermal management system using the coupler and heat-dissipating component. This eliminates the need for a large fan assembly while achieving the same heat dissipation function through compact thermal conduction pathways.
Solution Approach 2:
The mechanical cooling fan occupying significant space is replaced with a passive thermal conduction system that uses the existing coupler structure and integrated heat-dissipating components, thereby reducing the overall space required for thermal management in the compact device.
4Temperature
If heat is dissipated from the cover portion, then heat dissipation effectiveness is improved, but the display screen may be damaged by excessive heat
Solution Approach 1:
The patent applies different thermal properties to different regions of the cover portion. The heat-dissipating component is positioned to dissipate heat away from the display screen, while the coupler and insulating components are strategically placed to conduct heat away from sensitive areas. This localized thermal management protects the display screen from heat damage while maintaining overall heat dissipation effectiveness.
Solution Approach 2:
The coupler acts as a thermal intermediary that redirects heat flow away from the display screen toward designated heat-dissipating components. The insulating component serves as a thermal barrier that protects the display screen from direct heat exposure while allowing the heat-dissipating system to function effectively.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Efficient heat dissipation is achieved without energy consumption, preserving the small form factor and reducing user discomfort by dissipating heat through the cover portion rather than the base, while preventing damage to the display screen and minimizing thermal discomfort.
Implementation Method 1
The coupler is for thermally coupling the base portion to the cover portion. The coupler provides a path for transferring heat.
Implementation Method 2
The heat dissipating component includes a surface component that has several protrusions and several slots that increase the surface area of the surface component. The protrusions and the slots are configured to increase possible heat that can be dissipated from the cover portion to an external environment.
Implementation Method 3
The thermally insulating component is located between the display screen and the heat dissipating component.
Data Source
AI summary
Some implementations provide a folding electronic device that includes a base portion, a cover portion and a coupler. The base portion includes a region configured to generate heat. The cover portion includes a display screen, a heat dissipating component, and a thermally insulating component. The heat dissipating component is coplanar to the display screen. The thermally insulating component is coplanar to the display screen. The thermally insulating component is located between the display screen and the heat dissipating component. The coupler is for thermally coupling the base portion to the cover portion. The coupler includes a first component and a second component. The first component is coupled to the region configured to generate heat. The second component is coupled to the heat dissipating component of the cover portion. The coupler provides a path for transferring heat.