Condensers and electronic assemblies
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Solution Overview
Problem
Liquid-cooled configurations for power electronics systems are costly and complex due to the need for external pumps and radiators, which complicates heat management in high heat-flux applications like heavy-duty vehicle inverters.
Innovation Solution
A condenser design enabling passive, pumpless two-phase heat transfer using a condenser with vertical walls and fins that facilitate condensation of a coolant, allowing for efficient heat removal from semiconductor devices without the need for external cooling systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If liquid-cooled configurations are used to cool power semiconductor devices, then heat removal efficiency is improved, but system complexity and cost increase due to external pumps and radiators
Solution Approach 1:
The invention extracts and eliminates the external pump and radiator components from the cooling system. By integrating the condensation function directly into the heat sink structure with vertical condensation channels, the system removes the need for complex external liquid cooling infrastructure while maintaining effective heat removal from power semiconductor devices.
Solution Approach 2:
The invention merges the condensation function with the heat sink structure by integrating vertical condensation channels directly into the heat dissipation component. This combination eliminates the need for separate radiators and external pumping systems, reducing overall system complexity while preserving heat removal efficiency.
2Temperature
If liquid-cooled configurations are used for heavy-duty vehicle inverters, then heat management effectiveness is improved, but cost increases due to external pump and radiator systems
Solution Approach 1:
The invention extracts and removes the expensive external pump and radiator components from the cooling system. By implementing passive condensation through vertical channels integrated into the heat sink, the system achieves effective heat management for heavy-duty vehicle inverters at reduced cost.
3Productivity
If traditional liquid-cooled systems are used, then heat removal capability is improved, but the system requires external pumps and radiators increasing complexity
Solution Approach 1:
The invention implements a self-service cooling system where the heat sink with vertical condensation channels passively condenses coolant vapor and returns liquid coolant without requiring external pumps. The system serves itself by utilizing natural condensation and gravity-driven coolant return, maintaining heat removal capability while eliminating complex pumping infrastructure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides an efficient and cost-effective cooling method for power-dense electronics by utilizing passive two-phase heat transfer, reducing complexity and costs associated with traditional liquid-cooled systems while maintaining effective heat management.
Implementation Method 1
a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall
Implementation Method 2
a first plurality of fins extending in the vertical direction. Each of the first plurality of fins is connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall
Data Source
AI summary
Provided is a condenser for use in an electronic assembly. The condenser includes a first vertical wall extending in a vertical direction, the first vertical wall defining a first plurality of vertical condensation channels within the first vertical wall, a second vertical wall extending in the vertical direction, the second vertical wall defining a second plurality of vertical condensation channels within the second vertical wall, and a first plurality of fins extending in the vertical direction, each of the first plurality of fins connected to the first vertical wall, the second vertical wall or both the first vertical wall and the second vertical wall.