Passive Waveguide Structures for Integrated Spectroscopic Detection
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Solution Overview
Problem
Conventional optical spectroscopic systems for medical diagnostics are expensive, complex, and limited to laboratory settings, hindering widespread deployment and efficient sample analysis due to their size and requirement for specialized technicians.
Innovation Solution
A detection and sensing system integrating passive metallic structures with active semiconductor devices, such as waveguide array filters or meta-material filters, to selectively absorb or reflect electromagnetic radiation, enabling efficient radiation processing and reducing system complexity and cost.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional optical spectroscopic systems are used, then detection and quantification of physical, chemical, or biological target objects can be achieved, but the expense, size and complexity increase significantly
Solution Approach 1:
The patent merges multiple optical functions (collimation, filtering, dispersion, detection) into a single integrated photonic chip structure. The passive component integrates a collimating lens, optical filters, and photodetector array into one monolithic device, eliminating the need for separate laboratory instruments while maintaining detection precision.
Solution Approach 2:
The passive component performs multiple functions simultaneously: it collimates incident light, filters specific wavelengths, disperses light across different wavelengths, and detects the dispersed light patterns. This multi-functionality in a single component reduces overall system complexity while preserving measurement capabilities.
2Measurement precision
If conventional optical spectroscopic systems are used, then detection and quantification of target objects can be achieved, but the expense and cost increase significantly
Solution Approach 1:
The patent replaces traditional mechanical/optical bench systems with photonic integrated circuit technology. The passive component is fabricated using standard semiconductor manufacturing processes, substituting expensive custom-optics fabrication with scalable, high-volume semiconductor manufacturing, thereby reducing costs while maintaining measurement precision.
3Measurement precision
If conventional optical spectroscopic systems are used, then detection and quantification can be performed, but the time required for sample delivery and processing increases
Solution Approach 1:
The patent transitions from bulky three-dimensional optical systems to a planar two-dimensional photonic chip architecture. This dimensional reduction enables the entire detection system to be miniaturized and integrated, allowing samples to be processed locally without requiring delivery to remote laboratories, thereby reducing time loss while maintaining detection capability.
4Measurement precision
If conventional optical spectroscopic systems are used, then accurate analysis can be performed, but the requirement for specially trained technicians and elaborate protocols increases complexity
Solution Approach 1:
The passive component is designed to be self-contained and self-calibrating, requiring no elaborate testing protocols or specialized technician intervention. The integrated structure automatically performs alignment and calibration functions, enabling operation by non-experts while maintaining analysis accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The integration of passive metallic structures with active semiconductor devices in a monolithically integrated fluorescence detection system enhances the system's efficiency, cost-effectiveness, and ease of use, making it suitable for point-of-care diagnostics and bio-sensing applications.
Implementation Method 1
The passive component comprises at least one metallic structure dimensioned and arranged to absorb and/or reflect a major fraction of incident electromagnetic radiation received at one or more wavelengths of a first group of wavelengths
Implementation Method 2
The passive component comprises at least one metallic structure dimensioned and arranged to absorb and/or reflect a major fraction of incident electromagnetic radiation
Implementation Method 3
The at least one metallic structure comprises a waveguide array filter
Data Source
AI summary
Passive components adapted for integration with at least one active semiconductor device, in an embodiment, comprise at least one metallic structure dimensioned and arranged to absorb and/or reflect a major fraction of incident electromagnetic radiation received at one or more wavelengths of a first group of wavelengths. This prevents radiation within the first group of wavelengths from being received and/or processed by the at least one active device. In an embodiment, one or more metallic structures are dimensioned and arranged to direct an amount of incident radiation, received at one or more wavelengths of a second group of wavelengths, sufficient to enable receiving or processing of incident radiation within the second group of wavelengths by the at least one active semiconductor device. In some embodiments, the passive component comprises a passive optical filter for use in spectroscopic applications, and the active semiconductor device is a detector or sensor.