Paste-like Anisotropic Conductive Adhesive Bonding Method
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Solution Overview
Problem
The use of paste-like anisotropic conductive adhesives (ACP) in electric component connections results in lower throughput due to insufficient bonding strength for tentative fixing, requiring a single pressure bonding operation and higher costs associated with tape-shaped anisotropic conductive films (ACF).
Innovation Solution
An electric components connecting method using a paste-like anisotropic conductive adhesive with solder particles dispersed in a thermosetting resin, where the method includes a positioning step, a soldering step where pressure and heat are applied to tentatively fix the terminal arrays, and a final connecting step where the adhesive is set thermally, allowing for high-throughput connections.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If paste-like anisotropic conductive adhesive (ACP) is used for electric component connections, then cost is reduced compared to tape-shaped ACF, but bonding strength is insufficient for tentative fixing
Solution Approach 1:
The bonding process is segmented into two distinct stages: tentative fixing using ACP with solder particles, and final fixing using ACF. This segmentation allows each method to be optimized for its specific purpose - ACP for cost-effective initial bonding and ACF for strong final bonding, resolving the contradiction between cost and bonding strength.
Solution Approach 2:
Tentative fixing is performed as a preliminary action before final fixing. The ACP provides sufficient initial bonding strength to hold components in position during transport and positioning, enabling the subsequent final fixing step with ACF to achieve maximum bonding strength without requiring the expensive ACF from the outset.
2Productivity
If tape-shaped anisotropic conductive film (ACF) is used to provide high bonding strength for tentative fixing, then throughput can be increased by parallel processing, but cost increases and dedicated apparatus are required
Solution Approach 1:
The invention uses inexpensive ACP for the tentative fixing stage, which serves as a temporary but sufficient bonding solution. This allows the system to avoid the high cost of ACF while still enabling parallel processing and high throughput, as the ACP provides adequate bonding for the tentative fixing process.
3Strength
If ACF is used for tentative fixing, then high bonding strength is achieved, but dedicated apparatus for shaping and sticking ACF is required
Solution Approach 1:
The invention extracts the tentative fixing function from the final fixing process. By using ACP for tentative fixing and ACF for final fixing, the system eliminates the need for complex dedicated apparatus that would be required to shape and apply ACF for tentative fixing, while still achieving the necessary bonding strength at each stage.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables high-throughput connections by providing sufficient bonding strength for tentative fixing with molten solder particles, preventing positional deviation and maintaining high positional accuracy during transport, while reducing costs compared to ACF methods.
Implementation Method 1
a soldering step of tentatively fixing the connection portion of the first electric component and the connection portion of the second electric component to each other by soldering the first terminal array and the second terminal array to each other by melting the solder particles contained in the anisotropic conductive adhesive
Implementation Method 2
a connecting step of finally fixing the connection portion of the first electric component and the connection portion of the second electric component to each other by setting the anisotropic conductive adhesive thermally
Data Source
AI summary
A method for connecting a first terminal array 6 provided in a connection portion 5 of a first electric component and a second terminal array 8 provided in a connection portion 7 of a second electric component to each other in such a manner that electric continuity is established between them has two steps, that is, a step of tentatively fixing the two connection portions 5 and 7 with each other whose terminal arrays 6 and 8 are positioned with respect to each other by soldering them with solder particles 3 using a paste-like anisotropic conductive adhesive 1 in which the solder particles 3 and conductive particles 4 are dispersed in a thermosetting resin 2, and a step of finally fixing the two connection portions 5 and 7 with each other with the thermosetting resin 2 that has been set thermally. This prevents positional deviation from occurring between the two terminal arrays 6 and 8 during a transport from a tentative fixing apparatus to a final fixing apparatus.