Patch Antenna Packaging With Dielectric Spacing for Chip Interference
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Solution Overview
Problem
The integration of antennas and semiconductor chips in semiconductor packages leads to reduced antenna efficiency due to interference, as the chip overlap with antenna components, necessitating a solution to enhance isolation and efficiency.
Innovation Solution
Incorporating a dielectric feature between the semiconductor chip and the patch antenna, with a thickness selected based on the antenna's operating bandwidth, k-value, and area, to reduce parasitic capacitance and improve antenna efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a semiconductor chip is integrated with a patch antenna in a compact package, then the package footprint is reduced, but the antenna efficiency decreases due to parasitic capacitance and interference from the chip
Solution Approach 1:
A dielectric feature is introduced as an intermediary element positioned between the semiconductor chip and the patch antenna. This dielectric feature has a thickness specifically selected to reduce parasitic capacitance while maintaining compact integration. The intermediary dielectric structure allows the chip and antenna to coexist in close proximity without direct harmful interaction, thereby preserving antenna efficiency within a small package footprint.
Solution Approach 2:
The thickness of the dielectric feature is carefully controlled and optimized based on the antenna's operating bandwidth and electrical characteristics (k-value). By adjusting this critical parameter, the parasitic capacitance between the chip and antenna is minimized, allowing the system to achieve optimal antenna efficiency while maintaining a compact package design.
2Productivity
If the semiconductor chip is placed close to the patch antenna to reduce package size, then integration density increases, but interference from the chip reduces antenna efficiency
Solution Approach 1:
The dielectric feature serves as a mediator that enables high integration density by allowing close placement of the chip and antenna while simultaneously blocking harmful electromagnetic interference and reducing parasitic capacitance. This intermediary structure permits the chip to be positioned near the antenna for compact integration without suffering from direct interference effects.
Solution Approach 2:
The dielectric feature is strategically positioned in the specific region where the chip and antenna interact most strongly. By localizing the dielectric material at this critical interface, the solution针对性地 addresses the interference problem without requiring changes to the entire package structure, thus maintaining high integration density while eliminating local harmful effects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly increases the efficiency of the patch antenna, achieving up to 95% of the baseline efficiency with minimal interference, while maintaining a compact package footprint.
Implementation Method 1
a thickness of the dielectric feature is selected in order to reduce parasitic capacitance and improve efficiency of the patch antenna
Data Source
AI summary
An embodiment package comprises an integrated circuit die encapsulated in an encapsulant, a patch antenna over the integrated circuit die, and a dielectric feature disposed between the integrated circuit die and the patch antenna. The patch antenna overlaps the integrated circuit die in a top-down view. The thickness of the dielectric feature is in accordance with an operating bandwidth of the patch antenna.