Patch Antenna and Ground Plate Layout for Multiband Mobile Devices
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Solution Overview
Problem
The implementation of both LDS and patch antennas in mobile terminals for supporting 4G and high-frequency bands like UWB and mmWave is limited by mounting space constraints, leading to increased manufacturing processes and costs.
Innovation Solution
A multiband antenna structure is implemented using a single feed and ground structure, incorporating a patch antenna and a conductive plate connected to the ground, allowing for simultaneous transmission and reception of different frequency bands.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If both LDS antenna and patch antenna are implemented separately to support 4G and high-frequency bands, then communication functionality is improved, but mounting space is insufficient and manufacturing complexity increases
Solution Approach 1:
The patent combines the LDS antenna and patch antenna into a single integrated antenna structure. The LDS antenna is formed on the inner surface of the housing while the patch antenna is formed on the outer surface, allowing both 4G and high-frequency band communications to be supported within the same physical space, thus resolving the mounting space constraint.
Solution Approach 2:
The integrated antenna structure serves multiple functions simultaneously - it supports both 4G communication through the LDS antenna and high-frequency band communication through the patch antenna. This multi-functional design eliminates the need for separate antenna implementations, reducing both space requirements and manufacturing complexity.
2Adaptability or versatility
If both LDS antenna and patch antenna are implemented separately, then communication coverage is improved, but manufacturing processes and costs increase
Solution Approach 1:
The patent merges the manufacturing processes of LDS antenna and patch antenna into a single integrated structure. The LDS antenna is formed through laser direct structuring on thermoplastic resin, and the patch antenna is formed on the housing surface, allowing both to be manufactured together as one unit, thereby simplifying the manufacturing process and reducing costs.
3Adaptability or versatility
If separate antenna implementations are used, then frequency band support is improved, but device complexity increases
Solution Approach 1:
The integrated antenna structure is designed to support multiple frequency bands (4G and high-frequency bands) within a single unified structure. The LDS antenna portion handles 4G frequencies while the patch antenna portion handles high-frequency bands, creating a universal antenna solution that reduces structural complexity compared to implementing separate antennas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enables efficient support for 4G and high-frequency band communications, reduces manufacturing costs, and improves radiation performance.
Implementation Method 1
a dielectric layer including a first surface facing a surface of the housing and a second surface facing the PCB, and disposed between the PCB and the housing
Implementation Method 2
a patch antenna disposed on the first surface of the dielectric layer and electrically connected to a first point of the PCB
Implementation Method 3
a conductive plate disposed adjacent to the second surface of the dielectric layer and connected to a ground on the PCB through a second point spaced apart from the first point and overlapping with the patch antenna
Data Source
AI summary
An electronic device according to an embodiment may include: a housing forming at least a part of an exterior of the electronic device; a printed circuit board (PCB) disposed in the housing; a dielectric layer disposed between the PCB and the housing and comprising a first surface facing a surface of the housing and a second surface facing the PCB; a patch antenna disposed on the first surface of the dielectric layer and electrically connected to a first point of the PCB; a conductive plate disposed adjacent to the second surface of the dielectric layer, connected to a ground on the PCB through a second point spaced apart from the first point, and overlapping with the patch antenna; and a wireless communication circuit electrically connected to the PCB, wherein the wireless communication circuit is configured to feed power to the patch antenna through the first point of the PCB to transmit or receive a first signal of a first frequency band, and to transmit and/or receive a second signal of a second frequency band different from the first frequency band through a first electric path including the patch antenna, the conductive plate, and the ground.