Thermally Conductive Patch Antenna for High-Power Heat Dissipation
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Solution Overview
Problem
Conventional patch antennas face issues with high temperatures during high-power operation, leading to degradation of dielectric materials, shifts in resonant frequency, efficiency loss, and thermal expansion, which can cause warping and affect performance.
Innovation Solution
A thermally conductive patch antenna design that incorporates a thermally conductive cavity to dissipate heat, maintaining low operating temperatures even at high power levels, using a thermally conductive patch within a cavity that can be a single or separate component, connected mechanically.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If conventional patch antennas operate at high power levels, then transmission power is improved, but temperature increases causing dielectric degradation and resonant frequency shift
Solution Approach 1:
The patent converts the harmful thermal energy generated during high-power operation into a beneficial cooling mechanism by implementing a thermally conductive cavity that actively dissipates heat. The cavity, made of thermally conductive material, absorbs excess heat from the patch and radiates it away, transforming the harmful thermal buildup into a controlled heat dissipation process that enables sustained high-power operation without temperature-related degradation
Solution Approach 2:
The thermally conductive cavity serves as an intermediary heat transfer medium between the patch and the surrounding environment. It mechanically connects to the patch and provides a thermal conduction path that mediates the heat flow, allowing efficient heat removal while maintaining the structural integrity and electrical performance of the antenna system
2Power
If conventional patch antennas operate at high power levels, then transmission power is improved, but dielectric material degradation occurs leading to resonant frequency shift
Solution Approach 1:
The patent converts the harmful thermal energy that would otherwise degrade the dielectric material into a beneficial cooling effect. The thermally conductive cavity continuously removes heat from the patch and dielectric substrate, preventing the thermal degradation that would cause resonant frequency shifts, thereby maintaining reliable operation at high power levels
Solution Approach 2:
The patent changes the thermal parameter of the antenna system by introducing a thermally conductive cavity that fundamentally alters the heat dissipation characteristics. This parameter change in thermal management prevents the thermal buildup that would otherwise cause dielectric degradation and resonant frequency instability
3Power
If conventional patch antennas operate at high power levels, then transmission power is improved, but thermal expansion causes substrate warping
Solution Approach 1:
The patent converts the harmful thermal expansion that would cause substrate warping into a beneficial controlled heat dissipation process. The thermally conductive cavity provides a heat sink that actively removes thermal energy before it can cause significant thermal expansion and warping, maintaining the substrate's dimensional stability even during high-power operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design allows for high-power operation with minimal thermal damage, mechanical resilience, and consistent electromagnetic behavior, ensuring efficient and reliable performance.
Implementation Method 1
a thermally conductive cavity, wherein the first patch is located within and mechanically connected to the cavity, the cavity being configured to dissipate thermal energy from the first patch
Data Source
AI summary
A patch antenna includes a thermally conductive first patch, an RF feed and a thermally conductive cavity. The thermally conductive first patch is configured to transmit a radio frequency (RF) signal. The RF feed is configured to feed the RF signal to the first patch. The first patch is located within and mechanically connected to the thermally conductive cavity. The thermally conductive cavity is configured to dissipate thermal energy from the first patch.