Multilayer PCB Patch Antenna Layout for Integrated Calibration
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Current patch antenna designs face challenges in achieving high integration and miniaturization due to the need for separate printed circuit boards for patch radiators, feed networks, and calibration networks, leading to complex and large antenna systems.
Innovation Solution
The integration of patch radiators, feed networks, and calibration networks on a single multilayer printed circuit board, utilizing dielectric substrates and metal patterns with conductive connections, facilitates a compact and simplified electrical connection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If patch radiators, feed networks, and calibration networks are implemented on separate printed circuit boards, then each component can be independently designed and manufactured, but the overall antenna system becomes large and complex
Solution Approach 1:
The patent combines patch radiators, feed networks, and calibration networks onto a single multilayer printed circuit board. The first and second feed networks are implemented on different layers of the same PCB, as are the patch radiators and calibration networks. This merging eliminates the need for separate PCBs and inter-connector assemblies, directly reducing system complexity while maintaining independent design capability through layered separation.
Solution Approach 2:
The patent utilizes the vertical dimension by implementing different functional networks on different layers of a multilayer PCB. The patch radiators are on a first layer, feed networks on second and third layers, and calibration networks on fourth and fifth layers. This dimensional separation allows independent routing and design of each network while achieving high integration, resolving the contradiction between independent manufacturing and system complexity.
2Ease of operation
If separate printed circuit boards are used for patch radiators and calibration networks, then electrical connections between components are simplified, but the antenna system size increases
Solution Approach 1:
The patent merges all electrical connections within a single multilayer PCB structure. Conductive vias and trace routing on the same board provide direct electrical connections between patch radiators, feed networks, and calibration networks, eliminating the need for external connectors and inter-board wiring. This integration maintains connection simplicity while dramatically reducing the overall antenna volume.
Solution Approach 2:
The patent embeds multiple functional networks within the layered structure of a single PCB, similar to nested dolls. The feed networks and calibration networks are nested on different layers within the same physical substrate, with conductive vias providing vertical connections between layers. This nesting approach simplifies electrical connections by eliminating external wiring while minimizing the antenna system volume through compact integration.
3Adaptability or versatility
If multiple microstrip integrated circuits are integrated in a limited space for MIMO technology, then antenna functionality is enhanced, but integration and miniaturization become more difficult
Solution Approach 1:
The patent leverages the vertical dimension of multilayer PCBs to accommodate multiple microstrip integrated circuits and functional networks in a limited planar space. Different MIMO antenna elements and their associated feed networks are distributed across multiple layers, allowing high-density integration without increasing the antenna's footprint. This layered approach enhances MIMO functionality while managing integration complexity through systematic spatial organization.
Solution Approach 2:
The patent segments the antenna system into distinct functional layers, with each layer dedicated to specific circuits or networks. This segmentation allows independent design and optimization of each MIMO element and its associated feed network, reducing integration complexity. The modular layered structure facilitates systematic integration of multiple microstrip circuits while maintaining clear functional separation and reducing interference.
Data Source
AI summary
A patch antenna comprises a multilayer printed circuit board that includes a calibration network, an array of patch radiators and a feed network. In some embodiments, the multilayer printed circuit board includes a plurality of dielectric substrates, wherein the array of patch radiators is provided on a dielectric substrate different from the dielectric substrate on which the calibration network is provided, and the dielectric substrate provided with the array of patch radiators is provided above the dielectric substrate provided with the calibration network.