Integrated Patch Antenna Package With Horn for Compact RF Transmission
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Solution Overview
Problem
Existing microelectronic device packages face challenges in efficiently and cost-effectively integrating antennas due to interference from high dielectric constant materials, leading to the need for separate printed circuit boards, which are costly and require substantial device area.
Innovation Solution
A semiconductor package design that incorporates a patch antenna formed in a first conductor layer of a multilayer package substrate, with a reflector and ground plane layers, and an antenna horn mounted on the device side surface, allowing for efficient antenna integration within the package.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If antennas are placed on separate printed circuit boards or organic substrates spaced from semiconductor devices, then antenna efficiency is improved, but device area and cost increase
Solution Approach 1:
The patent merges the antenna structure with the package substrate by forming the antenna within the multilayer substrate itself, combining functions that were previously separated. The antenna is integrated into the substrate layers rather than being placed on a separate PCB, achieving both efficiency and area reduction.
Solution Approach 2:
The patent transitions from planar antenna designs to three-dimensional integrated structures by utilizing vertical layering within the multilayer substrate. The antenna is formed across multiple conductor layers separated by dielectric material, creating a volumetric structure that improves performance while minimizing footprint.
2Reliability
If antennas are placed on separate printed circuit boards, then antenna efficiency is improved, but manufacturing cost increases
Solution Approach 1:
The patent combines the antenna fabrication process with the existing multilayer substrate manufacturing process. Conductor layers, dielectric material, and vertical connections are formed in the same sequence, eliminating the need for separate PCB assembly operations and reducing overall manufacturing cost.
Solution Approach 2:
The multilayer substrate serves multiple functions simultaneously: it provides mechanical support for the semiconductor device, provides electrical interconnections through vertical connections, and houses the antenna structure. This multi-functionality eliminates the need for separate antenna substrates and reduces component count.
3Strength
If high dielectric constant materials are used in package substrates, then mechanical strength is improved, but antenna efficiency deteriorates
Solution Approach 1:
The patent applies different dielectric materials to different regions and layers of the substrate. High dielectric constant materials are used where mechanical strength is needed, while low dielectric constant materials are used in the antenna region to maintain efficiency. This localized material selection optimizes both strength and antenna performance.
Solution Approach 2:
The patent uses composite material structures combining different dielectric materials with varying dielectric constants. The multilayer construction allows optimization of each layer's material properties for its specific function, creating a composite structure that balances mechanical strength and antenna efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables the formation of microelectronic device packages with efficient and cost-effective antennas, reducing the need for external PCBs and minimizing device area requirements while maintaining effective signal transmission.
Implementation Method 1
a patch antenna formed in a first conductor layer... a reflector formed on a second conductor layer... The reflector is aligned with and spaced from the patch antenna
Implementation Method 2
The multilayer package substrate comprises conductor layers spaced from one another by dielectric material
Data Source
AI summary
An example semiconductor package comprises a patch antenna formed in a first conductor layer of a multilayer package substrate. The multilayer package substrate comprises conductor layers spaced from one another by dielectric material and coupled to one another by conductive vertical connection layers. The multilayer package substrate has a board side surface opposite a device side surface. The semiconductor package further comprises a semiconductor die mounted to the device side surface of the multilayer package substrate spaced from and coupled to the patch antenna. An antenna horn is mounted to the device side surface and aligned with the patch antenna using a mounting structure. The semiconductor package further comprises a reflector formed on a second conductor layer in the multilayer package substrate. The second conductor layer is positioned closer to the board side surface of the multilayer package substrate compared to the patch antenna.