Chip-Type Patch Antenna With Reinforcing Layer Cavity
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Solution Overview
Problem
Current chip-type patch antennas face challenges in achieving improved performance and reliability while maintaining a reduced size, as high dielectric constant layers used for size reduction can decrease radiation efficiency, and existing adhesive layers have low strength and reliability.
Innovation Solution
Incorporating a reinforcing layer with a high elastic modulus and a cavity between dielectric layers with high dielectric constants, and using adhesive layers with low dielectric constants to enhance radiation efficiency and structural stability, while maintaining a compact size.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If dielectric layers with high dielectric constant are used to reduce antenna size, then the antenna size is reduced, but radiation efficiency decreases
Solution Approach 1:
The patent applies local quality by using dielectric layers with different dielectric constants in different regions of the antenna structure. Specifically, high dielectric constant layers are used where size reduction is needed, while low dielectric constant layers are strategically positioned in regions where radiation efficiency is critical, thereby achieving both compact size and maintained radiation performance through spatially differentiated material properties.
Solution Approach 2:
The patent employs composite materials by combining multiple dielectric layers with different dielectric constants (including high-k and low-k materials) and integrating a reinforcing layer with adhesive layers. This composite structure allows the antenna to achieve size reduction from high-k layers while the low-k layers and air cavity minimize dielectric loss, and the reinforcing layer with adhesive layers ensures structural integrity, thus resolving the contradiction between size reduction and radiation efficiency.
2Strength
If adhesive layers are used to bond dielectric layers, then the layers are joined, but the bonding strength is insufficient and reliability is low
Solution Approach 1:
The patent uses composite materials by integrating a reinforcing layer made of materials with high elastic modulus (such as glass fiber reinforced plastic or carbon fiber reinforced plastic) between the dielectric layers. This reinforcing layer is bonded using adhesive layers, creating a composite structure that significantly enhances both bonding strength and structural reliability compared to using adhesive layers alone, while the low dielectric constant of the adhesive and reinforcing layers maintains radiation efficiency.
Solution Approach 2:
The patent applies segmentation by dividing the bonding and reinforcement function into separate components: adhesive layers for bonding and a distinct reinforcing layer for structural strength. This segmentation allows each component to perform its specific function optimally—the adhesive layers provide bonding while the reinforcing layer provides mechanical strength and reliability, resolving the contradiction between bonding strength and structural reliability.
3Reliability
If a reinforcing layer is added to improve strength and reliability, then structural stability improves, but device complexity increases
Solution Approach 1:
The reinforcing layer serves multiple functions simultaneously: it provides structural strength and reliability, acts as a dielectric layer with low dielectric constant to maintain radiation efficiency, and can be integrated with the adhesive layering process. This multi-functionality reduces the need for separate components, thereby limiting the increase in device complexity while achieving improved structural stability.
Solution Approach 2:
The patent merges the reinforcing layer with the dielectric layering structure, combining structural reinforcement and electromagnetic functionality into a single integrated layering system. The reinforcing layer is positioned between dielectric layers and bonded with adhesive layers, creating a unified structure that achieves structural stability without requiring separate reinforcement components, thus minimizing the increase in device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution stabilizes antenna performance by improving gain, bandwidth, and reliability, and allows for a more efficient use of space in electronic devices, effectively addressing the limitations of existing technologies.
Implementation Method 1
a reinforcing layer disposed between a first adhesive layer and a second adhesive layer, the reinforcing layer having a cavity
Implementation Method 2
the reinforcing layer has a first cavity penetrating a region between the fifth surface and the sixth surface
Implementation Method 3
a first adhesive layer is disposed between the second surface of the first dielectric layer and the fifth surface of the reinforcing layer, and a second adhesive layer is disposed between the third surface of the second dielectric layer and the sixth surface of the reinforcing layer
Data Source
AI summary
An antenna includes a first dielectric layer having a first surface and a second surface, a second dielectric layer having a third surface and a fourth surface, and a reinforcing layer disposed between the first dielectric layer and the second dielectric layer and including an insulating material. A first adhesive layer is disposed between the first dielectric layer and the reinforcing layer, and a second adhesive layer is disposed between the second dielectric layer and the reinforcing layer. A first pattern layer is disposed on a surface of the first dielectric layer facing the first adhesive layer, and a second pattern layer is disposed on a surface of the second dielectric layer facing away from the second adhesive layer. The reinforcing layer has a first cavity penetrating a region between the first and second dielectric layers.